Circuits Assembly Online Magazine - Features

Data Miner 2.0 data reporting software for manufacturing is said to bring the concept of lean to the development of manufacturing reports and analytics. Reportedly can retrieve, visualize, interrogate, and report on process, quality, production WIP, traceability, and performance information without requiring IT assistance, any database or reporting skill. Provides interactive, graphical way to incorporate historical manufacturing data in preconfigured reports without employing SQL. Reports are readily saved and delivered later by email or Web-based access. Once report is created and saved, the system can generate and send a report automatically. May be used alone or with iMonitor.

Aegis Software Corp., www.aiscorp.com

TechniShield is a plating process for individual shielding of active components. Offers direct plating to the molding compound; is said to create nonporous deposit that eliminates the need for metal caps or lids. Uses novel chemistry to roughen and plate the epoxy molding compound. Is chrome-free. Reportedly maintains excellent adhesion through multiple reflows and produces a pore-free surface.

Technic Inc., www.technic.com

2200-545 Series adjustable stroke mix-dispense valves are designed for controlled flow of 2-component adhesives and sealants, such as silicones, epoxies, urethanes and acrylics. Are based on the No-Drip valve body design for fluid control, featuring the integration of carbide ball-end needles and carbide seats. The adjustable stroke feature permits the operator to fine-tune the flow rate by rotating the threaded stem on the back of the valve. The valve is also available with an eyelet stem for attaching to a tool balance. Are 2.25" in diameter by 5.5" long, and are rated for 3,500 psi (240 bar). Double air actuated with two 1/8 NPT ports for a 4-way pneumatic valve connections. Body has two 1/4 NPT fluid inlet ports for Part A and B materials and accepts a wide variety of motionless mixers; has two screw holes and two dowel holes.

Sealant Equipment & Engineering Inc., www.SealantEquipment.com/2200-545

Bondjet BJ820 automatic wedge bonder, for round wire and deep access ribbon and wire bonding, is said to handle fine-pitch applications on a single platform, including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive – using aluminum or gold wire or ribbon. Reportedly has speeds up to 7 wires/sec. Axis repeatability of 1 μm at a balanced encoder resolution of 20 nm. A 12" x 16.1" work area can serve as two or more smaller stations. Capabilities include 12.5 to 85 μm diameter wire bonding; ribbon bonding from 6 x 35 μm to 25 x 250 μm; constant loop height and wire length; parallel loops within mixed reference system; auto teach for linear applications. Has a footprint of 720 x 1250 mm.

Hesse & Knipps, www.hesse-knipps.com

Conap Conathane EN-3010 is a filled two-component polyurethane potting compound. Is UL94 V-O recognized and RoHS compliant. Is flexible and is said to have a fast cure rate and low viscosity. Reportedly exhibits mix of 70 Shore A hardness, 100% modulus of 668 psi, and 139% elongation; has processing properties of 2,400 cps mixed viscosity at 25° C, 2:1 volumetric mix ratio, fast gellation, excellent storage stability, and a non-abrasive filler. Is suited for aerospace, automotive, computer, and defense SMT applications.

Cytec Industries Inc., www.cytec.com/conap

The Amkor 15 mmm Dummy PoP comes in a 0.65 mm pitch with a 160 I/O top and a 0.5 mm pitch, 605 I/O bottom. Is for PSvfBGA. Is the mechanical equivalent of a live component used only when physical properties are required.

Practical Components Inc., www.practicalcomponents.com