Fulabox dry box controls condensation that attacks moisture-Sensitive devices and filament.
Master Bond EP21AC is a two-part epoxy with non-halogenated filler formulated for applications where arc resistance and flame retardancy are required.
X858x and X698x science cameras provide high-speed and high-res thermal imaging for scientific research and engineering applications, including PCB test and measurement, within mid-wave infrared and long-wave infrared spectrum.
Megatron 8 material for multilayer printed circuit boards is for high-speed communication networking equipment such as routers and switches.
SCS PrecisionCure UVC microwave UV curing system features programmable curing profiles and small footprint.
Fine diameter 0.004" (0.10mm) flux-cored wire is made with Pb-free alloys to help meet requirements of fine-pitch applications.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association