Indium Corporation's LEDPaste NC38HF combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. Offers printability down to 60-micron apertures with excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.
Vitrox's V95i Advanced Robotic Vision (ARV) Solution Rotator is an additional hardware option to V9i ARV that is designed to fulfill final assembly inspection requirements in box build and PCBA products. Enables auto-conversion between inspections of PCBAs and box builds within a system.
Henkel Loctite Ablestik ATB 125GR is a high-reliability nonconductive die attach film suitable for wirebond laminate and lead frame packages, compatible with small- to medium-sized die, and formulated to provide excellent workability and processability.
Nordson's SELECT Synchro selective soldering system uses a unique, synchronous motion increase throughput, improve cost-of-ownership, and provide flexibility for high-volume printed circuit board assembly applications.
Metcal's firmware update for its Connection Validation Series soldering systems brings several new and improved CV features, including cartridge optimization capabilities, enhanced traceability, improved solder joint reliability, and more.
Zestron Vigon SC 200 stencil cleaner wipes manually remove solder pastes and adhesives from electronics assemblies.