Thermal transfer ELP printers include three models with three dpi formats: 220, 320 and 620. Are said to deliver durable print-head performance and print small labels. The ELP620 has micro-miniature printing capabilities. All are said to be functional, easy-to-use and easily maintained. Additional attachments can be integrated. Come equipped with multiple connection capabilities, including serial, parallel, USB, Ethernet and wireless. Have standalone mode.
Identco International, www.identco.com
Custom ratios are now available for the DX dispensing system. Custom ratios are said to provide customers with a versatile solution for two-component material dispensing. The system includes a mobile handheld dispenser with a DXR refill station, offering the ability to dispense a variety of ratios for two-component reactive resins. Multiple handheld dispensers reportedly can be refilled with one DXR refill station. The refill station utilizes two transfer pumps that feed from five-gallon bulk containers of material, each equipped with follower plates.
Mixpac Equipment Inc., www.mixpacequipment.com
Mixpac Equipment Inc., www.mixpacequipment.com
The Hot-Bar reflow desktop soldering system has pneumatic force adjustment available with a SH500 bonding head. Replaces spring technology and is said to cover a range up to 500N. Force is set by a manual knob; displays set range on a digital screen on the head. Typical joining applications include flex to PCB, wires to PCB, ribbon cables, and SMT components.
Miyachi Unitek, www.muc.miyachi.com
Miyachi Unitek, www.muc.miyachi.com
These three pick-and-place machines offer head-mounted cameras and Cognex processing for non-contact vision placement of 0201 chips to 16 x 14 mm SMDs and fine-pitch QFPs. Include a bottom vision camera for larger components to 38 x 38 mm. Said to have placement accuracy of ± .002" (± .05 mm) by linear-encoded X-Y drive mechanisms. Reportedly have availability of advanced time pressure digital dispensing for application at dot sizes down to 0.015 mm diameter. Use MC-300 Series control software. The MC-384 has a single head and a reported placement area of 14.5" x 13.4" for a capacity of 128 smart tape feeders. Its throughput is 4,000 cph. The MC-391 includes a three-stage conveyor and is said to have a speed of 5,500 cph on a large 14.75" x 23.4" placement area that can accommodate 160 tape feeders. The MC-387 has a 39.4" x 12" work area; can contain 224 smart tape feeders. Placement speed is said to be 5,500 cph.
Manncorp, www.manncorp.com
The PRO 2418 batch process style Laser Marking system has been designed to provide a means to mark a variety of PCBs. Said to handle PCBs up to 18" in width and 24" in length. Features include 40 W CO2 laser, red dot pointer, integrated PC with graphics, text, numeric and barcode software, and see-through laser-compliant glass.
Promation Inc., www.Pro-mation-Inc.com
The APR-5000-DZ advanced package rework system uses a dual convection bottom-side heater to enable controlled heating for rework of high thermal demand boards, including lead-free and multi-layer assemblies.
The PCT-100 focused preheater convection tool is said to maximize responsiveness to eliminate the threat of temperature overshoot. Reportedly ideal for use with lead-free and lead-rich solders. Said to deliver a preheat capability to enable manufacturers to perform assembly tasks at the appropriate peak temperatures without distorting the board.
The DX-250 digital dispenser reportedly allows manufacturers quick task setup. The DX-350 is said to dispense precise fluid volume with consistent high accuracy and repeatability.
The upgraded BVX-200 fume extraction system uses brushless motor technology. Is designed to extend operating lifetime, while enhancing performance.
OK International, www.okinternational.com
