The Electronic Self-Cleaning Metal Squeegee is said to provide a solution to solder paste dripping and clogging. Reportedly improves maintenance of the printer area, with less contamination of floors and surrounding SMT printer components when removed from printing machine. Said to enable hands-off, automatic squeegee cleaning of solder paste (including lead-free solder paste). Incorporates an odometer that counts the number of prints the squeegee has experienced, and allows the user to set a limit, after which a red light will flash indicating that the limit has been reached. Is available for EKRA, DEK, MPM, and Panasonic printers. Retrofits for other printer models are available on request.
Transition Automation Inc., www.Permalex.com
The Video ESD Training for Operators series, ESD: An Introduction, Manufacturing Controls, and Personal Grounding, focuses on electrostatic discharge control. Is targeted to electronics manufacturing facilities that require controls for ESD sensitive components and assemblies. Said to explain the importance of controlling static in the workplace, how static occurs and how to protect against discharge that can damage static-sensitive components.
Automated Learning Corp., www.automatedlearning.com
Selective soldering systems with internal (integral) preheating modules are for large, high-mass assemblies in which process heat is applied only to the bottom side. Said to promote the draw of solder through the barrel to the board topside. Includes continuous preheat during selective soldering.
ACE Production Technologies, www.ace-protech.com
HD Grid-Lok is a high-density tooling solution designed to support entire PCB assembly without manual intervention. Its 12 mm pin pitch reportedly can be set up in seconds. Is said to be ideal for high changeover manufacturing environments. Is based on a modular foundation concept; reportedly will conform to any board profile and to individual substrate topographies, with pins automatically locked into position.
DEK, www.dek.com
DEK, www.dek.com
FLO/PCB Version 4.1 thermal design software includes the ability to model potting compounds, probe temperature values interactively, provide user-defined temperature ranges and search component libraries. Is said to make it possible to perform board-level thermal simulation early in the design process. Includes a SmartPart object used to represent epoxy type solid cured potting compounds; can be placed over all or part of either side of the PCB. Multiple potting compound regions reportedly can be defined. Provides the ability to move the cursor over a temperature plot in the results visualization mode and report the point temperature. Using legend scaling options, users can define minimum and maximum values for the upper and lower bounds of the scale. Also includes an advanced search capability. Maintains bi-directional connectivity with Version 7.1 of Flotherm.
Flomerics, www.flopcb.com and www.flomerics.com
The 6-Pack Analysis Package is a sampling service designed to define the cleaning bath loading capacity for inline and batch cleaning processes. Consists of a set of sample bottles for regular sampling directly from the cleaning tank. Each sample is subsequently returned to the analytical center for detailed analysis. A bath-loading report is provided to users, including recommendations on how to further extend the cleaning agent’s bath life.
Zestron America, www.zestron.com
