Performance Upgrade packages for CBT6000 and Model 8000 automatic wire bonders and the Model 3500 component placement work cell include improved vision systems for pattern recognition and Bond Data Miner. BDM is a software package that monitors machine and process trends; can track and archive traceability data for each part, die, wire and bond; said to automatically adapt process parameters to address lot to lot and/or part variations; reports its own uptime and statistics to any computer.

Palomar Technologies, www.palomartechnologies.com

Hysol FP4581 and Hysol FP4583 are liquid epoxy encapsulants for use as underfills for flip-chip devices. FP4581 is a high-purity, liquid epoxy encapsulant formulated specifically for the requirements of high-lead, bumped large die flip-chip packages. Low CTE properties, improved toughness; forms rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance. Ideal for flip-chip devices that require improved crack and fracture resistance. Compatible with most no-clean flux systems. Contains fillers less than or equal to 2 µm in diameter and has been formulated for use with overmolded components in high-lead and Pb-free applications. Amine-based underfill systems are said to offer excellent adhesion to SiN and polyimide. Both are designed to deliver lower stress with the combination of thermal mechanical characteristics to prevent delamination, bump fatigue and UBM failure. 

Henkel Corp., www.henkel.com/electronics

Die sorter CS 1250 is said to use the latest technologies for robotic motion control and vision inspection. Pick-and-flip mechanisms are said to transfer die to tape reel at more than 16,000 parts per hour. Robotic head design permits post-flip inspection of the active surface of the die. Said to ensure quality of the part before placement. Parts are fully inspected before picking and placement to the tape pocket. Further inspected for mechanical quality, laser ID, and position in the tape pocket after placed. Any part that fails is automatically removed to a reject bin. A post tape seal inspection is performed. Uses single touch monitor screen. Features include 4-point vision inspection, real-time wafer map status, automatic calibration and auto tape load. Standard system handles 300 mm wafers.

Datacon Technology, www.datacon.at

CT for XiDAT XD7600NT digital x-ray inspection system is said to be capable of improved processing speed and finer feature recognition; ideal for complex 3-D devices such as stacked die, package-in-package and package-on-package. Is capable of examining microvias and looking for plating issues and micro-cracks. Equipped with a reconstruction server consisting of 16 processing units running in parallel. Analysis of die-attach quality and wire bond integrity within 3-D packages are said to be easily performed because of NT250 x-ray tube. Reportedly, real-time digital inspection with feature recognition capability as fine as 250 nm can be performed at 2 MP and viewed on a 24" flat panel LCD display with up to 9,200X magnification. Can convert x-ray system between 3-D and 2-D modes.

Dage Precision Industries, www.dage-group.com