The Green Monster ESD stencil wiping roll is Pb-free compatible and antistatic. Said to prevent sparks that can damage components and cause voids in solder traces. Uses coarse ESD fibers. Fabric is said to have an aggressive cleaning surface. Reportedly provides more voids to collect solder paste, as opposed to smearing that results from using paper. Is made of a cross-linked acrylic polymer that bonds the fibers together. Porous product permits full use of the vacuum system.
This environmentally safe circuit board cleaner will replace former cleaners that required special handling and disposal. Is nonflammable. Reportedly cleans better than previous solutions in most applications and without the need for fume evacuation or special toxic handling. Developed specifically for cleaning circuits and components to eliminate leakage through residue or contaminants. Said to work well on boards in high frequency and low voltage applications where contaminants cause failure. Available in liquid concentrate and is suitable for high-volume circuit board production equipment and special hand-cleaning applications.
The Grab-Eez wipe dispenser is said to be economical, dispensing only one wipe at a time. The double C-fold design gives each wipe an exposed edge so that the user can grab one wipe without touching the next. Said to conform to housekeeping practices and protects wipes from the environment until use.
Wedge emulation technology is for low profile interconnects, fine pitch, running stitch interconnects, and die-to-die bonding in high-density packages such as LEDs and RF packages. Uses Model 8000 ball bonder. Said to bond seven to 12 wires per second. Can program an interconnect beginning with a stitch instead of ball; complies with visual standards defined per Mil-Std-883, Method 2017. Can use a wire other than gold, such as aluminum or copper.
IPC-7351A LP Wizard is for the CR-5000 PCB and advanced packaging suite. This land pattern generator is said to reduce the time it takes to build a standard SMT footprint/symbol for a library part; ensures compatibility with the latest IPC standard for surface mount design. The task reportedly takes less than a minute. Consists of land pattern viewers, calculators and generators for the creation of CAD land patterns, including pads, padstacks and footprints/symbols in SMT parts libraries. Dovetails with free IPC library documentation and viewer provided with IPC-7351 standard. Data can be shared with engineers throughout organization on a project-by-project basis.
Blindmateable vertical headers have been added to the 4.2 mm PE series connector system. The system is a wire-to-wire, wire-to-board and wire-to-panel connector based on 4.2 mm x 4.2 mm centerlines. Headers are available in even position sizes, ranging from two up to 24. Reportedly can create system where exact positioning of mating connectors is aided by the funnel lead-in of the housing to permit easier alignment and mating in wire-to-board applications. Is available in UL 94V-2 or UL 94V-0 housing materials; contacts are tin-plated or gold-plated brass. Are rated for 9A max. (two-position version) and 600 VAC. Rated for 50 mating and unmating cycles and said to be suitable for intermating and interchanging with competitive products as well as AMP-DUAC connectors.