The Traceability and Control Validation Kit is designed to validate manufacturing process and provide the potential for rich product and process traceability detail. Is reportedly the first measurement tool for manufacturers to validate their plants’ traceability and control based on rating traceability. Is designed to help engineers quickly find key products needed to qualify their assembly technology. Is also said to provide the physical materials and procedural guide to determine a factory’s traceability and control capability, and to rate the results in a formalized matrix.
Aegis Industrial Software Corp., www.aiscorp.com
Practical Components Inc., www.practicalcomponents.com
Three semiconductor testing procedures for QFN, DFN, CSP and WLP semiconductor packages use “test on tape“ process, with MCT Tapestry Film Frame Handler. Said to test multiple package types and sizes without requiring mechanical conversion kits. “Test after singulation” process reportedly eliminates semiconductor defects caused by mechanical sawing after electrical testing. The “wafer to pocket die traceability” system is said to track every unit from the wafer through test and inspection to the specific pocket on a reel of taped units; allows customers to perform virtual retest of taped devices in the event of a specification change or new OEM requirement.
Best Electronics and US Export Authority, www.usea.com
CM10 has been specifically designed for simultaneous double-sided cleaning of large format substrates. Applications include PCBs, flat panel displays, screen printing, LCDs, lamination, packaging and glass manufacture. Has elastomer contact cleaning rollers and adhesive system. Four large-diameter elastomer rollers are said to remove unattached particles down to one µm and transfer them to a high coat weight, pre-sheeted, reverse-wound adhesive roll. Analysis and assessment of the source of contamination is made possible. Has cleaning module tilt system. Includes 7kv anti-static system. Operation up to 40 m/min.
Teknek, www.teknek.com
SJ7 Mini solder bars build on properties of the SJ7 solder alloy. Are approx. 110 mm long, 8 mm wide and 5 mm high; said to be ideal for small dipping pots and solder fountains. Yield results for applications involving harsh environments, thermal cycling and high strain. Said to feature improved tensile and creep strength, time to rupture, wetting capabilities and yield.
Almit Technology, www.almit.com
Almit Technology, www.almit.com
The M22XDL-350 desktop AOI features a small footprint and is for inspecting PCBs, including SMT and THT components, reflow and wave solder joints, and solder paste. Introduces three-pulse wave modulated LED light sources and up to six different lighting combinations. Enhanced by Rep 22X Statistics and Repair Desk Software. Monitors inspection process in real-time while visualizing collected data. Features 24-bit color imaging. Reportedly overcomes limitations of 8-bit greyscale imaging.
Marantz Business Electronics, www.marantz.com
Marantz Business Electronics, www.marantz.com
The Weller WHA900 Hot Air Station features a closed-loop feedback control said to maintain desired temperature at the nozzle, independent of the airflow rate. The sensor, located inside the nozzle, adjusts heat output based on user-selected settings. Its hot air pencil, usable with a wide range of nozzles, reportedly yields a 650W output and a temperature range of 100° to 1,000°F.
Cooper Hand Tools, www.cooperhandtools.com/weller
