The Symbion P36 Plus AOI features 3-D and 2-D detection and is said to provide 100% volumetric solder paste inspection accuracy. Enhanced with latest architecture and high-powered processing capabilities. Includes process control software. Has central data hub where all relevant data are stored. Automatically links post-reflow AOI inspection data with solder paste inspection data and SPI results with paste printer machine events. Alerts when processes are out of operator-defined parameters and can stop a related machine.
MPM Accela printer now comes with Benchmark 2.0 machine operating software. Is said to offer significant post-print inspection enhancements; integration of barcode scanning for product traceability and process verification; singulated processing of indexed Auer boat substrates, and support for CAMX machine data streaming per the IPC-2541 specification. Includes SpeedVision inspection architecture. Said to increase the speed of contrast-based pad coverage inspection and texture-based BridgeVision and StencilVision through the use of full field-of-view processing, rapid image acquisition and optimized camera travel. Decrease in inspection time reportedly ranges from 40 to 70%.
The CV629 cartridge valve weighs 4.8 oz. and is suitable for lubricants, silicones and adhesives. Said to be ideal for manual operations for which where frequent dispensing deposits must be applied. Is recommended for integration in an automated system, where the quick-change one-piece cartridge seal ensures minimal maintenance and reduced downtime. Stroke is adjustable and valve is recommended for micro shots or fine-beads. Maximum fluid pressure is 300 psi.
Laser cutting system is for SMT solder paste stencils and other thin metal components and parts. Said to cut standard SMT stencils at 13,000-18,000 apertures per hr. (an increase of 30-50%). Features include LongLife laser source, which consists of a high-power fiber laser; reportedly operates at reduced power requirements. FastCut beam delivery system enables MultiCut to cut small apertures of any shape without any table motion. Said to boost production throughput, especially when cutting BGA and µBGA stencils.
The real-time top-side preheating module is for high-mass assemblies. Promotes draw of solder through barrel to the board’s top side. Provides internal continuous preheat during selective soldering. Can be used as the primary preheating function or to maximize productivity when used in combination with discrete pre-heaters to maintain board temp. during soldering operation. An optical pyrometer reads actual PCB temperature with real-time, closed-loop control.
HDPE Pure-Touch liquid dispensing bottles are available with chemical names acetone, isopropanol, and DI water. Imprints are said to be non-smearing and non-running. Ideal when multiple chemicals are being used on a single workstation. Square shape provides stability and allows compact storage. Capacity is 4 oz.