The M22XDL-350 desktop AOI features a small footprint and is for inspecting PCBs, including SMT and THT components, reflow and wave solder joints, and solder paste. Introduces three-pulse wave modulated LED light sources and up to six different lighting combinations. Enhanced by Rep 22X Statistics and Repair Desk Software. Monitors inspection process in real-time while visualizing collected data. Features 24-bit color imaging. Reportedly overcomes limitations of 8-bit greyscale imaging.
The Weller WHA900 Hot Air Station features a closed-loop feedback control said to maintain desired temperature at the nozzle, independent of the airflow rate. The sensor, located inside the nozzle, adjusts heat output based on user-selected settings. Its hot air pencil, usable with a wide range of nozzles, reportedly yields a 650W output and a temperature range of 100° to 1,000°F.
Virtual Panel Carrier centers substrates and is said to enable multiple component support and alignment during screen printing and all subsequent assembly processes. Enables alignment once; reportedly no further adjustments are required. Design consists of a base carrier with a consumable foil. Said to provide stability, centering and alignment capabilities required to process substrates or components in a single panel. Parts are placed manually or loaded with a placement system. Substrates are held in the carrier via a patented four-sided tensioning mechanism. Parts are referenced using two global fiducials. Is scalable.
SIwave v3.5 is a full-wave electromagnetic field simulator optimized for signal-integrity, power-integrity, and electromagnetic interference analysis of high-speed PCBs and IC packages. Features a finite-element-based DC solver optimized for extraction of power rail geometry in low-voltage/high-current PCBs and packages. Engineers reportedly can view voltage and current distributions in all relevant geometry, including vias and bond wires; have access to voltage drop and current flow information through vias, bond wires, sources, resistors, inductors, etc. in tabular format. Said to simulate electromagnetic behavior of complex PCBs and IC packages, including multiple, arbitrarily shaped power and ground layers, and any number of vias and signal traces. Full-wave S-, Y- or Z-parameters or GHz-bandwidth circuit model is used in concert with time- and frequency-domain analyses within Nexxim and DesignerSI or third-party SPICE-compatible circuit tools. Highlights include 64-bit capability; frequency-dependent source implementation; linear interpolation; frequency-dependent material model (Djordjevic-Sarkar); visualization of near E and H fields, and clip design tool.
The SmartStream pump is said to eliminate striking of a piston to a seat or nozzle. Each cycle displaces a column of material, rather than a single sphere. Cycles at frequencies that create a stream of material that reportedly can deliver increased flow rates (greater than 70 ÿl/sec). The displacement piston, driven by a linear motor/encoder assembly, is carbide. Design allows for easy removal and cleaning of the fluidic module. Only three o-rings need to be replaced. Z travel of dispense head is said to be virtually eliminated, as material is released from a nozzle 2-3 mm above the PCB surface. Reduces number of height senses needed.
SMP300 screen printer has a three-stage conveyor to eliminate additional buffer units. Features a patented clamping process to ensure the board is in the proper plane. Uses two CCD cameras to view and teach fiducials for aligning the board to the stencil within ±0.025 mm. Has a closed-loop, pneumatically controlled print head, and comes with 2-D post print inspection and automatic wet or dry stencil cleaning. Prints for 01005 pads.