The Ultra-Cure UV Curing Module offers topside curing of UV-curable conformal coatings and other UV-curable materials. Uses a modular design to deliver consistent curing of various width substrates up to 18". Is equipped with Fusion UV Systems Model F300 SQ lamps and is designed to accommodate up to three 6" lamps. Uses a PLC-based control system with an operator interface terminal for setup and alerting.
The BVX-200 Fume Extraction System with brushless motor technology is said to eliminate wear out of motor parts and increase system lifetime in normal operation. Is also said to deliver improved extraction performance and has a wider range of operating modes. Advantages include enhanced reliability, zero dust generation and increased motor efficiency. Electrical noise and RF interference are reduced, and sparking between brushes and commutator rings reportedly is eliminated. Is available in all systems and will not affect part numbers.
The ScanBooster/USB-FXT is based on a USB2.0 interface. Provides solution for critical TAP accesses to ATE fixtures and HASS/HALT applications. JTAG/Boundary Scan Test, PLD programming and In-System programming can be executed over longer distances. Features two TAPs and supports programmable TCK frequency up to 16MHz max. Obtains flexibility and safety via distances up to 4 m to the Unit Under Test. Provides 32 programmable voltages, dynamic Parallel I/O, two ADC/DAC channels, external trigger signals and three static I/O. Can be used for extended test and PLD/Flash programming operations.
AOI tools include Advisor process control software, which provides a central data hub for storing SMT quality data. Reportedly gives a broad view of quality relevant metrics for the entire line from a single source. Said to provide highly accurate inspection results. Automatically links post-reflow AOI inspection data with paste AOI inspection data and paste inspection results with paste printer machine events. Includes an alarm engine that alerts when processes are out of operator-defined parameters. Can be integrated with existing manufacturing execution or shopfloor system.
The APR-5000-DZ array package rework system is said to enable fast ramp and tighter delta temperature control for Pb-free rework without affecting adjacent and underside components. Expands capability to rework odd-form and temperature-sensitive components. Reportedly delivers highly targeted and controlled heating for rework of high thermal demand boards, including multilayer assemblies up to 12" x 12". Has a dual convection bottom-side heater that consists of large and small area heaters. Can rework components with 0.4 mm pitch. Enables rework of components where vacuum pickup is not an option. Strobe light facilitates viewing the dual image of both component and board. Is for small, high-density boards used in mobile phones, handheld instruments and personal media players.
The X8060 NDT universal x-ray and CT inspection system performs nondestructive test on larger, heavier objects. Is for automotive, aviation and aerospace, medical technology, turbine construction, machine tool manufacturing, materials science, ceramic and synthetics production, electronics, sensor technology and bonding technology. An integrated, computed tomography permits 3-D reconstruction of test objects up to 66 lbs. Has microfocus x-ray tube with a max. acceleration voltage of 250 kV. Capable of inspecting hidden solder joints in electronics assemblies using high magnification and angled radiation. Modular precision manipulator has up to eight CNC-capable axes.