The PhotonicFlow System is reportedly the first complete, functional lab-on-a-chip system. Is comprised of a multiwell chip, a handheld device controller and readout software. Combines printed semiconductors with various lab-on-chip technologies. Uses handheld device controller for electronic readout of the signals from the photodetector and readout software.
Bioident, www.bioident.com
Flotherm Version 7 electronics thermal analysis software features a response surface optimization capability. Fits a 3D surface to the entire design space. Automatically creates and runs the required number of simulations to explore the entire design space. Generates a "response surface" showing the value of the design goals for all the combinations of variables run. Said to have better design insight and intuition; rapid determination of which design parameters are crucial, and instant assessment of the effects of manufacturing variations. Applications include heat sink design; PCB component placement; fan/blower selection and the location of vents. Has the ability to embed arbitrary conductive thermal resistor networks within the overall fluid dynamics simulation. Includes a SmartPart that models heat pipes accurately and the ability to import 2D DXF files and extrude them directly into 3D shapes.
Flomerics, www.flomerics.com
The DX-350 Series of Digital Dispenser/Controllers is microprocessor-driven and fully digital. Reportedly dispenses precise fluid volume with consistent high accuracy and repeatability. Has an operating pressure of 0-100 psi and is designed to dispense a wide range of fluid viscosities. Is equipped with user friendly, intuitive firmware. Guarantees size-shot accuracy and control of drips between cycles with a digital timer, digital pressure and vacuum readout. Has 10 programmable memories capable of storing and recalling most frequently used dispensing cycles. Operates from a 24V DC supply and is ready to use with a power adapter, air hose, sample tips, barrel, syringe adapter and syringe stand. Features a timer range of 0.0080 to 60.00s.
OK International, www.okinternational.com
The T-2800 self-contained precision temperature forcing system for electronic component testing incorporates a built-in air compressor that reportedly eliminates the need for an external air supply at the test location. Has a temperature range of -60˚C to 200˚C, an airflow rate of 300 SCFH, a small footprint, and an intuitive user interface. Incorporates a receiver tank; after-cooler; water separator; a heatless desiccant air dryer; an integrated test arm, a pneumatically controlled test head, and self-diagnostics capability.
Thermonics, www.thermonics.com
Model 40366 surface-mount accelerometer is said to have capabilities ideal for implantable medical device applications. Is a variable capacitance, silicon MEMS device designed to meet the requirements for use in implantable devices. Hermetically sealed with a shear bond strength of 1 kg; delivers repeatability of less than 0.035 pF in an SMT footprint of 2.05 x 2.90 mm configured as a three-terminal half-bridge. Features include frequency response of 40 Hz, linearity of less than 1%, transverse sensitivity of less than 1%, a +/-2g full scale for measurement of fractional-g accelerations in the presence of earth’s gravity, and over-range stops with provisions to eliminate electrostatic sticking when the accelerometer is over-ranged.
Endevco Corporation, www.endevco.com
The Dow Corning DA-6534 high-performance thermal adhesive addresses the issue of overheating in advanced flip-chip BGA devices. Combines silicone-based chemistries with a silver filler to achieve high thermal conductivity and elasticity at high and low temperatures. Achieves thermal resistance of 0.09 cm2 C/W at 24µ. Said to offer good dispensability. Bondline thickness can be controlled through pressure and time.
Dow Corning Corporation, www.dowcorning.com
