AUTOset software subsystem incorporates KIC Vision auto-profiling and generates a preliminary reflow profile based on a PCB assembly’s physical characteristics. Also fine-tunes preliminary recipes to optimize the profile. Is installed in all new XPM3 Series reflow-soldering machines. Identifies suitable oven recipe prior to running a single profile.
 

A family of SPDIP mating pin headers complements a line of SPDIP sockets. Shrink plastic packaging is said to reduce device lead spacing between pins down to 0.070" pitch. Used in memory, microcontrollers, video controllers and automotive design applications. For interconnect applications such as board stacking, socket testing and elevating circuits off the board surface. Precision-machined using brass alloy 360 and configured with pluggable tails.
 
Mill-Max, www.mill-max.com

Flashstream flash programmer currently supports more than 160 device part numbers from Samsung, Intel, Spansion, ST Micro, Hynix, SST and Atmel. Comes in two models: 3000FS contains four programming sites, is rated at 1050 devices per hour, and handles parts in tray, tube or tape for device input or output. HelixFS is rated at 800 cph. Current universal site supports more than 25,000 device part numbers.
 
BPM Microsystems, www.bpmicro.com