Circuits Assembly Online Magazine - Features

The Niton XL3 Series third-generation handheld XRF analyzer is said to provide the fastest solder alloy grade identification and laboratory-quality composition analysis of plastics and polymers. Typical time for routine solder screening measurements is said to be less than 5 sec. Features a 50 kV, 2W x-ray tube. Comes in a range of configurations with an assortment of optional features and accessories; quick screening to simultaneous measurement of up to 25 elements in a sample. Offers component testing; solder analysis; populated PCBs and finished goods; hi-reliability screening.

Thermo Fisher Scientific Inc., www.thermo.com/niton

The M3i provides materials management and printing capabilities. Is comprised of materials management cartridges, a ProFlow enclosed printer head, and Europa printing platform. Offers programmable ratio mix control and imaging of a variety of materials. Materials are preloaded into climate-controlled cartridges and stored at low temperature, then heated within the print head when elevated materials temperatures or melting processes are required. Is said to be completely scalable and can be used for underfill, encapsulation, solar cell and fuel cell imaging. Said to be fully automated and programmable; throughput is improved; operator intervention errors are eliminated; waste is reduced.

DEK, www.dek.com

The Symbion P36 Plus AOI features 3-D and 2-D detection and is said to provide 100% volumetric solder paste inspection accuracy. Enhanced with latest architecture and high-powered processing capabilities. Includes process control software. Has central data hub where all relevant data are stored. Automatically links post-reflow AOI inspection data with solder paste inspection data and SPI results with paste printer machine events. Alerts when processes are out of operator-defined parameters and can stop a related machine.

Orbotech Ltd., www.orbotech.com

MPM Accela printer now comes with Benchmark 2.0 machine operating software. Is said to offer significant post-print inspection enhancements; integration of barcode scanning for product traceability and process verification; singulated processing of indexed Auer boat substrates, and support for CAMX machine data streaming per the IPC-2541 specification. Includes SpeedVision inspection architecture. Said to increase the speed of contrast-based pad coverage inspection and texture-based BridgeVision and StencilVision through the use of full field-of-view processing, rapid image acquisition and optimized camera travel. Decrease in inspection time reportedly ranges from 40 to 70%.

Speedline Technologies, www.speedlinetech.com

The CV629 cartridge valve weighs 4.8 oz. and is suitable for lubricants, silicones and adhesives. Said to be ideal for manual operations for which where frequent dispensing deposits must be applied. Is recommended for integration in an automated system, where the quick-change one-piece cartridge seal ensures minimal maintenance and reduced downtime. Stroke is adjustable and valve is recommended for micro shots or fine-beads. Maximum fluid pressure is 300 psi.

I&J Fisnar Inc., www.ijfisnar.com

Laser cutting system is for SMT solder paste stencils and other thin metal components and parts. Said to cut standard SMT stencils at 13,000-18,000 apertures per hr. (an increase of 30-50%). Features include LongLife laser source, which consists of a high-power fiber laser; reportedly operates at reduced power requirements. FastCut beam delivery system enables MultiCut to cut small apertures of any shape without any table motion. Said to boost production throughput, especially when cutting BGA and µBGA stencils.

LPKF Laser & Electronics, www.lpkfusa.com