AutoVue v.19.2 is an EDA-centric product offering that addresses specific requirements of PCB design and contract manufacturing. Is for viewing, reviewing and collaborating on EDA files. Includes native viewing, markup and secure real-time collaboration capabilities via the Web for manufacturing documents, PCB layouts, schematics and Office documents. Electro-Mechanical Professional provides format support for EDA, 3D, 2D and Office document types in a single solution; said to bridge the gap between MCAD and EDA. Delivers enhancements and new format support for manufacturing, A/E/C, oil and gas, and plant design communities, including AutoCAD 2008, SmartSketch 4.0 & 5.0, SolidEdge 19, Inventor 2008 and more.

The SN100C Pb-free alloy flux system is available in low VOC, VOC-free, alcohol-based formulations, solder paste form, and also as paste and liquid fluxes; appropriate for wave, reflow, selective, and hand (cored wire) soldering. Has a synthetic base that reportedly provides stability under the higher temperatures required by Pb-free alloys. Said to work well in air or under a nitrogen blanket. Is compatible with many different finishes, including OSP, Ni/Au, Ag and Sn.

Cobar Solder Products, www.cobar.com

The Traceability and Control Validation Kit is designed to validate manufacturing process and provide the potential for rich product and process traceability detail. Is reportedly the first measurement tool for manufacturers to validate their plants’ traceability and control based on rating traceability. Is designed to help engineers quickly find key products needed to qualify their assembly technology. Is also said to provide the physical materials and procedural guide to determine a factory’s traceability and control capability, and to rate the results in a formalized matrix.

Three semiconductor testing procedures for QFN, DFN, CSP and WLP semiconductor packages use “test on tape“ process, with MCT Tapestry Film Frame Handler. Said to test multiple package types and sizes without requiring mechanical conversion kits. “Test after singulation” process reportedly eliminates semiconductor defects caused by mechanical sawing after electrical testing. The “wafer to pocket die traceability” system is said to track every unit from the wafer through test and inspection to the specific pocket on a reel of taped units; allows customers to perform virtual retest of taped devices in the event of a specification change or new OEM requirement.

Best Electronics and US Export Authority, www.usea.com