A family of SPDIP mating pin headers complements a line of SPDIP sockets. Shrink plastic packaging is said to reduce device lead spacing between pins down to 0.070" pitch. Used in memory, microcontrollers, video controllers and automotive design applications. For interconnect applications such as board stacking, socket testing and elevating circuits off the board surface. Precision-machined using brass alloy 360 and configured with pluggable tails.
Mill-Max, www.mill-max.com
Mill-Max, www.mill-max.com
Flashstream flash programmer currently supports more than 160 device part numbers from Samsung, Intel, Spansion, ST Micro, Hynix, SST and Atmel. Comes in two models: 3000FS contains four programming sites, is rated at 1050 devices per hour, and handles parts in tray, tube or tape for device input or output. HelixFS is rated at 800 cph. Current universal site supports more than 25,000 device part numbers.
BPM Microsystems, www.bpmicro.com
BPM Microsystems, www.bpmicro.com
The MT-300 Pb-free dual wave solder system is available for low- to mid-volume, defect-free soldering of high-density boards populated with through-hole, surface-mount, or mixed technology components. Small footprint (8' long); uses dual transducer-controlled motors for uniform wave heights; features an adjustable titanium finger conveyor with a max. board width of 11.75". Automatic finger cleaner is standard, as are titanium-alloy solder pot, wave nozzles, and heavy-duty pumping system. Pot capacity of less than 500 lbs.
Manncorp, www.manncorp.com
The online interactive Alpha Wave Solder Flux Selector tool is designed to assist assemblers in identifying the best Alpha flux for their application. Said to meet the challenges of Pb-free and SnPb processes. Reportedly offers environmental and worker safety benefits while providing soldering and reliability performance. Can be found at http://www.alphametals.com/showCookWSFCalc.asp.
Cookson Electronics, www.cooksonelectronics.com
eTEC is a thin film embedded thermoelectric cooler that addresses thermal management needs. Functions as a miniature, solid-state heat pump. Is ideal for cooling hot spots that result from localized areas of high heat flux on an IC. Is manufactured using semiconductor processing techniques. Said to maximize current flow and minimize heat flowing back from the hot side to the cold side of the IC. Adds 100 µm of height to a heat spreader. Reportedly has a millisecond response time to maintain precise temperature. Pumps a max. heat flux of 150 W/cm2, with some designs delivering as much as 400 W/cm2.
Nextreme, www.nextreme.com
Self-Saturating Foam Swabs quickly and cleanly remove contaminants from hard-to-reach electronics components, magnetic heads and other areas where high-reliability cleaning is required. Contain IPA/DI fluid, consisting of 91% isopropyl alcohol and 9% deionized water. Handle is manufactured from clear polypropylene; the swab tip is comprised of 100 PPI foam. Solvent and applicator combined in one unit. Is a non-aggressive cleaner, suitable for use on plastic or metal surfaces. High evaporation rate. Each swab is filled with 1.4 ml of IPA/DI; tip is 100 PPI Foam, is 27 mm in length and is 14.25 mm wide. Available in packs of 50. Boiling point is 82-83°C and flash point is 12°C.
QTEK Manufacturing Ltd., www.qtek.com
