The Momentum (MPM) printer features CANopen motion control and I/O architecture. Its vision system includes a USB digital camera with look-up/look-down capability, telecentric lens, and advanced lighting techniques. Includes contrast-based 2-D, BridgeVision and StencilVision, all with SpeedVision; new transport and squeegee systems, vacuum stencil wiper and roller solvent bar delivery system. Machine operation with Benchmark software has wizards for error recovery, machine functions and utilities. Reportedly, a new product file can be created in less than 10 min.; any existing process program can be used as template. RemoteTech diagnostics package enables remote support and troubleshooting. Includes a single, front-fixed rail conveyor with top clamp and centernest vacuum hold down and a 17" flat panel display. Board size capability from 609 x 508 mm to 50.8 x 50.8 mm. Accuracy and repeatability is said to be +/-12.5 µm at 6 sigma (Cpk greater than or equal to 2), with a cycle time as fast as 10 sec. (excluding print).
The SP600 automated batch printer comes with a table that can be designed with a standard fixation or a customer-specific substrate holder. Because of shuttle system, any kind of substrate holders reportedly can be used. Enables printing of solder paste onto PCB, conductive glue printing on flex circuits, and special paste application on ceramic on one system. Print table is motorized in four axes (x, y, c and theta); said to allow automatic alignment of the substrate to the stencil. Two vision cameras measure reference structures and calculate offset. Operator can see in real-time which squeegee, stencil or tension frame must be installed. Is said to be ready in less than five minutes for new job. Comes prepared for 29" stencil frames. Substrate holder is designed for single or double-sided PCBs up to 450 x 500 mm. Rubber or metal squeegees with a length of up to 500 mm can be used. Features automatic stencil cleaning (dry, wet, vacuum).
vPlan software will be provided to Spectral Response Inc., enabling faster transition from NPI to full production with a reported seamless coverage for all production lines, including Siemens, Fuji, Universal and Panasonic machines. Will help increase overall equipment effectiveness through process automation. Includes new capabilities, such as auto-generation of machine shapes from VPL. Delivers manufacturing process definitions to the production floor, and automatically generates machine-specific libraries on demand.
The FLX2010 SMD pick-and-place comes with 190 feeders and permits feeder changeover during operation. Said to place 5,000 cph. Enables placement of 0201 or 0.3 mm components, tall condensators (height up to 15 mm), large connectors and BGAs with 50 mm side length. Features a combination of laser and vision centering systems. Feeder management system automatically recognizes feeders and pickup height. LEDs show feeder status and notify the operator if a minimum quantity is reached. Feeder setup control system is based on barcode identification. Machine programming can be prepared offline during production.
AutoVue v.19.2 is an EDA-centric product offering that addresses specific requirements of PCB design and contract manufacturing. Is for viewing, reviewing and collaborating on EDA files. Includes native viewing, markup and secure real-time collaboration capabilities via the Web for manufacturing documents, PCB layouts, schematics and Office documents. Electro-Mechanical Professional provides format support for EDA, 3D, 2D and Office document types in a single solution; said to bridge the gap between MCAD and EDA. Delivers enhancements and new format support for manufacturing, A/E/C, oil and gas, and plant design communities, including AutoCAD 2008, SmartSketch 4.0 & 5.0, SolidEdge 19, Inventor 2008 and more.
The SN100C Pb-free alloy flux system is available in low VOC, VOC-free, alcohol-based formulations, solder paste form, and also as paste and liquid fluxes; appropriate for wave, reflow, selective, and hand (cored wire) soldering. Has a synthetic base that reportedly provides stability under the higher temperatures required by Pb-free alloys. Said to work well in air or under a nitrogen blanket. Is compatible with many different finishes, including OSP, Ni/Au, Ag and Sn.