This double-row SMT strip socket accepts 0.025"-0.037" diameter and 0.025" square pins. Is offered standard in four- up to 100-position configurations on 0.100" spacing. The 0.276" tall insulator is manufactured with high-temperature thermoplastic suitable for reflow soldering operations. Is rated at 4.5 A per position. Is available in RoHS-compliant and traditional platings. For connector configurations up to 10 positions per row, the coplanarity of the leads is 0.005". 

Mill-Max, www.mill-max.com

HPC-Z interconnections are said to provide signal connections only where desired, with functional isolation for single or double-side surface-mount partitions. Solves thick board drilling and wire density problems. Has capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. Provides interconnections within the board, and reportedly eliminates unnecessary PTH drilling. Vertical connection with a lamination is in place of a PTH; aspect ratios for drill and plate are limited to sub-assembly dimensions. Increased wiring density because of smaller vias and lands.

Endicott Interconnect Technologies, www.eitny.com

ScanAssist, part of the System Cascon boundary scan software platform, enables real-time activation and analysis of individually defined logic states directly in the target hardware (pin/net toggler) without prior test program generation. Features automatic identification of potentially unsafe or hardware harming vectors and logic states of non-boundary scan nets and pins. Is complemented by interactive graphical visualizer Scan Vision III. Reportedly can apply a data flow-oriented, virtual schematic for interactive logic probing in a completely integrated development environment. Logic levels can be provided in object browsers and ASCII files, as well as in schematic and layout visualizer. Virtual schematic enables the synthetic combination of native schematic sectors. A tracing of the entire debug session is possible because all user interactions are recorded separately.

Goepel Electronic, www.goepel.com

Axiom X-1030 Series dispenser is for selective jetting of traditional flux, no-clean solder fluxes and other precise coating applications. Comes in single or dual-lane configurations. Said to optimize underfill and package reliability, improving production throughput and equipment utilization by as much as 60-85%. Configured with DJ-2200 DispenseJet valve with coaxial air technology. Maintains 0.5 to 1.5 mm edge definition. Minimizes overspray associated with other spraying techniques. Said to ensure consistent, ultra-thin flux film builds (as low as 5 µm) by following jetted flux with a pulse of air.

Asymtek, www.asymtek.com