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Model 40366 surface-mount accelerometer is said to have capabilities ideal for implantable medical device applications. Is a variable capacitance, silicon MEMS device designed to meet the requirements for use in implantable devices. Hermetically sealed with a shear bond strength of 1 kg; delivers repeatability of less than 0.035 pF in an SMT footprint of 2.05 x 2.90 mm configured as a three-terminal half-bridge. Features include frequency response of 40 Hz, linearity of less than 1%, transverse sensitivity of less than 1%, a +/-2g full scale for measurement of fractional-g accelerations in the presence of earth’s gravity, and over-range stops with provisions to eliminate electrostatic sticking when the accelerometer is over-ranged. 
 
Endevco Corporation, www.endevco.com

 
The Dow Corning DA-6534 high-performance thermal adhesive addresses the issue of overheating in advanced flip-chip BGA devices. Combines silicone-based chemistries with a silver filler to achieve high thermal conductivity and elasticity at high and low temperatures. Achieves thermal resistance of 0.09 cm2 C/W at 24µ. Said to offer good dispensability. Bondline thickness can be controlled through pressure and time.

Dow Corning Corporation, www.dowcorning.com

Universal Cover Tape reportedly provides optimal performance regardless of width, carrier material and equipment. The UCT peel features permit removal of the middle portion above component pockets, while adhesive edges remain adhered to the carrier. Said to simplify sealing parameters associated with current heat-activated and pressure-sensitive adhesive cover tapes, in addition to increasing productivity, reducing sealing complaints and eliminating adhesive contamination.
 

Autograph AG-X Series testers measure loads from 100N to 100kN using a single load cell and are reportedly accurate within ±0.5% with a 1/1000 load cell. Have portable USB memory and Trapezium X software. After testing, USB memory can be used with a PC to analyze data and create reports. Developed using Microsoft.net; allows users to combine graphed results from separate tests, create histograms and X-barR charts, and access data from any Web-based environment. Use large-capacity load cells and testing jigs. Features include 32-bit, 144-mHz MPU, FPGA-controlled synchronized sampling and motor control, 5 kHz sample, 1M pulse per sec. resolution, seven analog input channels, three digital input channels, and precision positioning for all speeds. Come equipped with multiple channel data acquisition, nine language interfaces, resistance values acquisition, and scheduling functions.

 
Shimadzu Scientific Instruments, www.ssi.shimadzu.com

The XiDAT XD7600NT digital x-ray inspection system is now equipped with a standard 2.0 MP imaging system. Provides up to 70° for any position 360° around any point of the entire 18" x 16" inspection area; inspects all interconnections and PCBs containing BGA and CSP devices. The NT250 x-ray tube has 250 nm submicron feature recognition and real-time digital inspection at 2.0 MP viewed on a 24" flat panel LCD display with up to 9,200X magnification. Can be equipped with a CT option providing 3-D modeling and volumetric measurement of solder joints.
 
Dage Precision Industries, Inc., www.dage-group.com  
 
CAM350 v. 9.5 for PCB verification and optimization adds a variety of features including AutoImport templates; PADS layout import interface updates; license borrowing, and Vista support. ODB++ Import supports the CAD Netlist as a reference in CAM350. The One-Up and Panel Border To Layers commands convert to graphics. Netlist Extract algorithm updates are said to support faster performance for large files. DXF Export Interface updated to support intuitive selection of layers to export. AutoImport command supports saving default NC Data format specifications. More than 35 software corrections have been made.


DownStream Technologies, www.downstreamtech.com

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