CPL827 clear polyester liner label, for auto-apply applications, is designed for harsh environments (up to 300°C). Is a low-cost material said to match polyimide or Kapton performance and is rigid enough for automation. Features a robust liner combined with a rigidly constructed label. Comes in green, yellow and white.
Nortec Inc., www.nortecid.com
Flopack V6.2 Web-based SmartPart library reportedly generates fast, accurate thermal models for IC packages and associated parts. Thermal models can be instantly imported into novel software to analyze component, board and system cooling requirements. Features a major expansion of the power/discrete semiconductor package library; a new parametric rules engine that checks for errors in design data inputs; and enhanced, more accurate bond wire model.
Flomerics, www.flopack.com
PowerClean II cleans lead-free circuit boards during manufacturing, rework and repair. Formula is based on Vertrel solvents from DuPont and VersaTrans solvents from PPG. Said to be ideal replacement for ozone-depleting solvents. Is alcohol-free with reportedly no risk of white residues.
MicroCare, www.microcare.com
Alpha EF-2210 wave solder flux offers soldering and electrical reliability performance. Complies with environmental regulations. Is a VOC-free, no-clean, low-solids, rosin-free flux that passes the Bellcore SIR electrical reliability requirement. Uses an activator system said to minimize micro-solder balls, bridging and icicles. Water-based, non-flammable formula. Is Pb-free and SnPb compatible.
Cookson Electronics, www.cooksonelectronics.com
Cookson Electronics, www.cooksonelectronics.com
The AX-201 places many different types of components with a reported accuracy of better than 20 microns at single-digit defects per million. Places 01005 components, fine-pitch devices and odd-form components up to 130 x 79 mm with machine vision and laser alignment. Is suitable for both stand-alone and line-balancing applications with the AX-301 or AX-501. It has a placement rate of up to 18,000 cph. Placement force is programmable from 0.9 to 40 N. Feeders are configurable to hold up to 212 pick positions and 376 Jedec trays. Shares common user interface, feeders, trolleys and placement heads with other A-Series machines. Is designed for medium and large batch production in both high and low product mix environments.
Assembléon, www.assembleon.com
Assembléon, www.assembleon.com
The Handheld Laser-Focus Camera System for small-spot testing captures a digital picture and test results for compliance RoHS screening tests in an XRF Analyzer. Isolates test areas by placing a test spot down to 3 mm diameter and displaying the image and sample target on the color PDA screen in real-time. Ideal for evaluating non-homogeneous parts such as PCBs where the beam can be focused on a small component, solder joint, lead or terminal. Can switch from collimated pinpoint to full-field analysis. Snapshot images of samples analyzed plus laser-targeted small-spot analysis are saved in test records. Said to measure up to 25 elements in a single test.
Innov-X Systems, www.innov-x-sys.com
Innov-X Systems, www.innov-x-sys.com
