Circuits Assembly Online Magazine - Features

The VS/NS 800-1000 series reflow ovens come with eight or 10 heating and two cooling zones. Are nitrogen capable, with self-contained chillers. Control temperatures to a reported 1°C. Feature dual thermal sensors for heater protection, step force cooling capable of 3°C/sec. cooling slope; independent temperature and blower speed controls. Come standard with KIC 24/7 remote process monitor.

JT Electronic Equipment, www.jt-ele.com

The DSP-1008 fully automatic screen printer comes with 2-D print inspection and analysis. Maximum conveyor speed is 1,500 mm/sec.; print speed is six to 200 mm/sec. Repeat positioning accuracy is reportedly +/-0.01 mm, printing accuracy is +/-0.025 mm. Cycle time is said to be less than 10 sec. Handles screens of 400 x 500 to 737 x 737 mm, and PCBs of 50 x 50 to 400 x 340 mm.

Shenzhen Desen Precision Machine Co., www.desen-sz.com

EA-6800 microelectronic adhesives for flip-chip semiconductor packages are said to offer two-fold improvement in cure rate; EA- 6900 is specifically formulated for the high temperatures that Pb-free assemblies must endure during rework. Are RoHS compliant. Cure in about 15 min., reportedly with no loss of performance. Come in production quantities. Feature reduced voiding from residual moisture within substrates and maintain a low modulus.

Dow Corning Corp., http://www.dowcorning.com/electronics

The DXH-3 hand-held dispenser weighs 5.3 lbs., with a 25 ml. max. output per stroke. Said to be ideal for dispensing in tight spaces and handling small-size applications. Dispenses a wide variety of ratios for two-component reactive resins. Can be refilled with a single DXR refill station. The refill station utilizes two transfer pumps that feed from 5-gal. bulk containers of material.

Mixpac Equipment Inc., www.mixpacequipment.com

AUTOset software subsystem incorporates KIC Vision auto-profiling and generates a preliminary reflow profile based on a PCB assembly’s physical characteristics. Also fine-tunes preliminary recipes to optimize the profile. Is installed in all new XPM3 Series reflow-soldering machines. Identifies suitable oven recipe prior to running a single profile.

Vitronics Soltec, www.vitronics-soltec.com

A family of SPDIP mating pin headers complements a line of SPDIP sockets. Shrink plastic packaging is said to reduce device lead spacing between pins down to 0.070" pitch. Used in memory, microcontrollers, video controllers and automotive design applications. For interconnect applications such as board stacking, socket testing and elevating circuits off the board surface. Precision-machined using brass alloy 360 and configured with pluggable tails.

Mill-Max, www.mill-max.com