The KISS-100 rework soldering machine is a contact-based system designed to selectively remove or install components such as connectors, through-hole components, and odd-form devices into boards, panels and other assemblies without disturbing nearby SMT components. Combines standard KISS solder pot and pump with a universal PCB holding and indexing nest and a vertical/tilt motion. Uses angular (tilt) extraction from the solder wave. This “tilt” motion reportedly permits solder to drain off component leads, preventing solder bridging and icicles. Control features are said to provide tools to set all process parameters including immersion depth, dwells in solder tilt extraction, travel distances and speeds, solder temperature and wave height. Nozzles are available to accommodate connectors up to 6" long. Handles PCB panels up to 18" x 24". Is Pb-free capable.
 

The compact Model 28.400 dual-wave solder system reportedly can handle large throughput while changing from one board width to another up to 15.75". Just under 10' long with a 53" preheat zone and average capacity of 250 boards per hour. Has an auto-adjust finger conveyor, with a built-in automatic, continuously re-circulating cleaning system. Comes standard with a 400 mm titanium solder pot. Includes spray fluxer, advanced touch-screen control, and worm-screw adjustment. Wave activation is said to be automatic when sensors detect arrival of PCBs. 
 

This 68-position MDR I/O board-mount receptacle connector conforms to standard SCSI-2 pin-and-socket interfaces. Permits use of MDR wiper-on-wiper connectors in applications that previously required pin-and-socket SCSI-2 connectors. Is reportedly suitable for an array of box-to-box applications, including telecommunications, networking, enterprise computing and factory automation. Its ribbon-style contact is said to eliminate “pin stubbing” failures and is reliable in repetitive plug-unplug applications.
 
3M, www.3m.com
 
 

Aquanox A4625B is an MEA-free aqueous blend specifically designed for batch washers. Is said to remove flux residues and contaminants associated with most electronics assembly processes. Is said to be environmentally friendly. Reportedly is used at low concentrations for optimum cleaning efficiency without damaging delicate substrates.
 
Kyzen Corporation, www.kyzen.com