The MV-7L provides one top-down camera and four side-view cameras, each with a native resolution of 2 MP. The “Quad Angle Lighting System” is said to provide four independently programmable zones. Intelli-Scan laser reportedly precisely measures the z-height of a given region. Is said to provide four point height measurement capability for BGA and CSP coplanarity testing and enhanced solder paste measurement capability. Provides “drag and drop” component programming. Typical programming time said to be less than one hour per assembly.
 
Mirtec, www.mirtecusa.com
 
 
 

The Juki 100 table/benchtop selective solder machine has a gliding carrier where the nozzle is lifted through the access hole to the soldering location. Then the nozzle is lowered back to the home position. The PCB then moves to the next soldering location via the gliding carrier. After positioning, the solder nozzle will go up through the access hole again and solder the next location. The gliding board carrier reportedly causes no friction across the top of the board. Said to not rely on special carriers or software to ensure level soldering. Features simple XYZ servo axis system borrowed from the XY fluxer. Includes a four-step setup. Maintenance is said to require no tools.
 

The Label Master 1100P label attachment system is reportedly fully automated. Uses SMEMA communication to stabilize PCBs during label placement, and has a front stopper and side-gauging device in the conveyor. Can dispense printed labels through the label printer or a preprinted label on a roll. Uses a robot placement positing system. Features a gantry-type robot (X-, Y- or Z- axis); 1- or 2-D scanner label verification; a fiducial-based board orientation/label centering vision camera, and TCP/IP data communication. Labels can be attached at a variable angle by applying the ÿ-axis (0° ~ 360°).
 

Lead-Free Solder Paste Remover is a blend of aliphatic glycol ethers, isopropyl alcohol and DI water. Said to be RoHS-compliant and usable with any type of solder paste. Can be used to clean stencils, screens, misprinted boards, tools, benches, machinery, and can remove chip bonder epoxies.