Loctite 3508 is a Cornerbond underfill system designed for CSPs and BGAs in Pb-free environments. Benefits reportedly include higher throughput, reduced manufacturing costs and improved pot life. Is a one-component epoxy cornerfill engineered for process optimization with curing taking place during normal Pb-free solder reflow. Said to permit component self-alignment. Is preapplied to the board at the corners of the CSP pad site using a standard dispensing system. Has six-month shelf life, a pot life greater than 75 hours, and can be stored under standard refrigeration. Other advantages reportedly include improved adhesive strength over previous versions and a reworkable feature that enables defective components to be removed. 
 
Henkel Corporation, www.electronics.henkel.com

PADS2007 is said to offer the ability to implement RF and microwave circuitry using automated functionality and perform design for fabrication (DFF) checking early in the design process. Enhancements include high-speed analysis/verification functionality; controls for matched length nets and differential routing improvements; square and chamfered corners; DXF-in import, and via matrixing enhancements for RF design. Designs with partial vias (blind or buried) are automatically updated with the layer pairs and drill count of the partial vias in the design; alpha-numeric pin improvements simplify creation of large BGA-based parts; ECO enhancements include comparison of design rules between the schematic and layout databases. Fabrication checks, such as acid trap, starved thermals, solder mask slivers are checked in the CAD environment and database. Can turn on/off the visibility of the component pin numbers. Integration of DxDesigner and the HyperLynx LineSim tool.

Mentor Graphics Corporation, www.mentor.com