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EP40 is a flexible, two-component epoxy resin compound. Is especially designed for bonding, sealing and casting engineering plastics and metals. Has been formulated to cure readily at ambient or more quickly at elevated temperatures with a non-critical one-to-one mix ratio by weight or volume. Reportedly includes superior resistance to thermal cycling and mechanical vibration and shock, and excellent electrical insulation properties. Adheres to engineering plastics, such as polycarbonates, acrylics and ABS to steel, aluminum and other metals. Shear and peel strength for bonding polycarbonates are in the order of 1000 psi and 20 pli respectively, while steel and aluminum bonds yielded shear strength values as high as 1800 and 1500 psi. Said to have service temperature range of -100°F to +230°F. 
 
Master Bond, www.masterbond.com

BluePrint for PCBs Version 1.7 creates documentation for PCB fabrication, assembly and inspection. Functionality and enhancements include advanced visibility functionality for components, pins, nets, drills, ref designators, part names and attributes. Reportedly permits finetuning of each PCB view display to better articulate manufacturing instructions. Also includes customer driver defect resolutions and enhancements for dimensioning and drafting commands; complete API documentation release; a direct integration link via ODBC to Omnify Software SQL database; search functionality; PADS 2007 support and PADS stroke font support; replication of headers on split tables for parts lists, variant lists, component lists, etc. Available April 6 as a free download to customers with maintenance contract.
 
DownStream, www.downstreamtech.com

 
EMARS software supports China RoHS environmental compliance regulation. The module is designed to help companies comply with Phase One of the China RoHS regulation and prepare for Phase Two. Is said to enable users to generate an accurate declaration chart in the "x-and-o" format. Reportedly can generate a completed chart that accurately reflects a product's composition in minutes. No manual loading of product bills of material is required. Can perform rollups of complex, multi-level product BoMs into a single "x-and-o" chart; configure chart rows to represent major subassemblies of the product and individual components; drill down analysis on any "x-and-o" chart; determine what supplier part or material is contributing to a compliance failure and why; worst-case analysis on all multisourced component permutations of a product; best-case analysis to identify scenarios that meet shipment goals, and maintains the latest substance lists and thresholds associated with the China RoHS law. 
 
Synapsis Technology, www.synapsistech.com/china-rohs

Model 2500-DA is for two-part viscose compounds containing abrasive filler. Is a positive displacement machine capable of reducing wear because of its double-acting design and abrasion-resistant metering cylinders and seals. The double-acting inline design reportedly reduces stress caused by high viscosity fluids and delivers on-demand dispensing without interruption for reloading the metering cylinders. The 2500-DA is said to double the life expectancy of seals by reducing the recharge cycles necessary during dispensing. Uses 4-way flow directional valves for maintaining accurate flow ratios.
 
I&J Fisnar Inc., www.ijfisnar.com

The OptiCon SmartLine AOI system is a desktop system for small series to be applied as offline test or repair station. Is equipped with a camera-based imaging unit featuring custom telecentric lens and a flexible illumination concept of different colors and directions. Can also serve as a programming station. PC is completely integrated in the main chassis; only monitor and keyboard need be connected. Has a PCB inspection area of 400mm x 300mm.
 
Goepel Electronic, www.goepel.com 
 
 
Multicore LF600 is a halide-free, no-clean Pb-free solder paste formulated for humidity resistance and said to be ideal for varying manufacturing climates. Permits printing and reflow performance in temperatures up to 86°F with 80% relative humidity. Has been designed with a gelling component that enables zero hot slump. Delivers an open time of 24 hrs. and an abandon time of 4 hrs. Is available for stencil printing 0.4mm pitch QFP and 0.4mm CSP devices and can be used with surface finishes such as NiAu, immersion Sn, immersion Ag and OSP copper.

Henkel Corp., www.henkel.com/electronics

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