The ETR-100 single shuttle bay depaneling station is built on rugged platforms. Is designed for low- to mid-volume depaneling requirements and incorporates a single shuttle bay for operator loading and unloading of PCB arrays. Integrated touch panel displays operational sequence as the system progresses through its functions. Permits process viewing.
Promation Inc., www.Pro-mation-Inc.com
Alpha WS-819 water-soluble, Pb-free solder paste reportedly withstands 50% +/-15% humidity. Developed for Pb-free PCBs. Is said to provide long stencil life, reduced printing cycle time, voiding resistance, and water cleaning without saponifiers and special waste water treatment and disposal systems. Has been tested on Enthone OSP, Alpha immersion silver, and immersion tin and ENIG finishes.
Cookson Electronics, www.cooksonelectronics.com
The Agilis Stick Magazine uses stick-feeding technology. Also uses a precision linear drive and servo-controlled horizontal motion to feed up to 50 mm long components in up to 28 mm high sticks; moves the stick forward and immediately pulls straight back to advance components through the stick, into the pickup position. No manual feeding required. Key benefits are said to include increased accuracy and reliability; quick setups and changeovers; wide component range; one magazine handles all, and removable stick pallets with ID and barcode.
MYDATA, www.mydata.com
The OptiGuard stencil system is part of the VectorGuard stencil range. Provides an alternative mounting process, helpful when stepped or multi-level stencils are deployed. Can be used with laser-cut, precision-etched, laser-formed or electro-formed stencils. Can be purchased from DEK, Tecan, or any stencil manufacturer licensed to sell the technology.
DEK, www.dek.com
This double-row SMT strip socket accepts 0.025"-0.037" diameter and 0.025" square pins. Is offered standard in four- up to 100-position configurations on 0.100" spacing. The 0.276" tall insulator is manufactured with high-temperature thermoplastic suitable for reflow soldering operations. Is rated at 4.5 A per position. Is available in RoHS-compliant and traditional platings. For connector configurations up to 10 positions per row, the coplanarity of the leads is 0.005".
Mill-Max, www.mill-max.com
HPC-Z interconnections are said to provide signal connections only where desired, with functional isolation for single or double-side surface-mount partitions. Solves thick board drilling and wire density problems. Has capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. Provides interconnections within the board, and reportedly eliminates unnecessary PTH drilling. Vertical connection with a lamination is in place of a PTH; aspect ratios for drill and plate are limited to sub-assembly dimensions. Increased wiring density because of smaller vias and lands.
Endicott Interconnect Technologies, www.eitny.com
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