SMX Series surface mount DC to 18 GHz packages reportedly have low insertion loss and good return loss and thermal properties. Designed to provide good electrical transition performance for die. Made to provide wideband electrical performance and incorporate copper composite bases for thermal dissipation. Sealed with cup-shaped liquid crystal polymer lids with B-stage epoxy preforms.
QTEK Adhesive Remover reportedly eliminates misprinted adhesives and pastes before they cure and attach themselves to screens or PCBs. Is an isoparaffinic hydrocarbon, and reportedly contains no ozone-depleting substances, and is RoHS and WEEE compliant. Is available in tubs of 100 pre-saturated wipes, 500 ml spray bottles, 5 liter containers and more.
The X7056 features parallel AOI and automatic 3-D x-ray inspection with top and bottom optical views. Microfocus x-ray tube has a reported resolution of 15 µm per pixel. Iterative Easy3D software yields highly accurate image quality. Includes 6 MP sensors, and can be equipped with AOI cameras for simultaneous top- and bottom-side PCB inspection. Simultaneous inspection and double-track loading lower handling times. Is fully modular, and can be used as a combination AOI/AXI or pure AXI system.
HumiSeal UV40 reportedly won’t crack under thermal cycling. The polyurethane-polyacrylate hybrid, UV-curable polymer structure coating is said to have low viscosity. Said to be physically flexible, particularly in response to thermal cycling duress. Has reported low solvents (less than 3% content); meets all ISO 14001 and major health and safety and hazardous chemical regulatory requirements.
Medalist 5DX automated x-ray inspection’s 8.4 software release reportedly contains specialized algorithms that permit inspection of quad-flat, no-lead (QFN) components with reduced false call rates; defect characterization on non-wetted direct FET (field-effect transistor) by using an open slope paste test; and a threshold enabling inspection for solder presence along side edges of capacitors.
TheLNC 60 is used to simultaneously align components on six nozzles on each placement head inside JUKI’s newest pick-and-place machines. The LaserAlign sensor reportedly allows the component alignment process to perform rapidly on the fly. Will be used in KE-2070 series of high-speed chip shooters and KE-2080 series of high-speed flexible mounters, reportedly capable of placing down to 01005 components.