The SI-C1500 SPI is said to be capable of high-speed, accurate post-reflow visual inspection. Features MOSIAC color processing software that reportedly enhances detection accuracy and speed. Said to extract color elements from each board and identify defects based on color contrast. Features a 1.3 MP color CCD camera. Can view angle-mounted components. 
 

The SMT1000-ZD is reportedly capable of removing rosin, no-clean and water-soluble fluxes. Said to be compatible with Pb-free solders and solder pastes. A single button is said to direct the machine to wash, rinse and dry full loads of assemblies. Has a built-in chemical management system that automatically mixes and doses wash chemical into the wash-solution recycling system. Recycling system permits wash solution to be filtered and reused on subsequent cycles. Zero-discharge configuration operates in locations where drain lines are not available. Additional standard features include SPC data logging with network-compatible viewing, 10.4" graphic touch-screen interface, unlimited alpha-numeric recipe generation, ESD-safe adjustable board rack and “Focus-Wash” defluxing technology.
 
Aqueous Technologies Corporation, www.aqueoustech.com
 

The MV-7L provides one top-down camera and four side-view cameras, each with a native resolution of 2 MP. The “Quad Angle Lighting System” is said to provide four independently programmable zones. Intelli-Scan laser reportedly precisely measures the z-height of a given region. Is said to provide four point height measurement capability for BGA and CSP coplanarity testing and enhanced solder paste measurement capability. Provides “drag and drop” component programming. Typical programming time said to be less than one hour per assembly.
 
Mirtec, www.mirtecusa.com
 
 
 

The Juki 100 table/benchtop selective solder machine has a gliding carrier where the nozzle is lifted through the access hole to the soldering location. Then the nozzle is lowered back to the home position. The PCB then moves to the next soldering location via the gliding carrier. After positioning, the solder nozzle will go up through the access hole again and solder the next location. The gliding board carrier reportedly causes no friction across the top of the board. Said to not rely on special carriers or software to ensure level soldering. Features simple XYZ servo axis system borrowed from the XY fluxer. Includes a four-step setup. Maintenance is said to require no tools.