The PMT400 rework system is designed for rework of microBGA, BGA, CSP, SMT, MCM and PTH assemblies. Proprietary Windows-based X-PC Advanced Process software provides GUI, featuring intuitive programming and Teach Mode profiling. Is Pb-free capable. Features precision gantry motion and a standard two-zone IR bottom heater. Provides performance in a small 28" sq. footprint. Includes a six-nozzle starter, network data management (XP Pro), real-time thermal control (external TC), automatic retract optics and an automated component pickup nest. Can handle 0.010" minimum component size, and offers a 2" sq. field of view, as well as 2" top- and bottom-side clearance. Provides 1 kW focused convection top heater and 14 x 20" maximum board size with 1.5 kW IR bottom heater.
 
VJ Electronix, www.vjelectronix.com
 

For low-profile IO applications, this surface mount SIP socket strip is assembled parallel to its board surface. Ideal for placement near the board edge for easy access test connections and creating pluggable adapter modules, which can sit perpendicular to the motherboard. The brass alloy receptacle press-fit accepts mated pin diameters between 0.025-0.037" and 0.025" square posts. This socket is rated at 4.5A per pin position. Suitable for reflow soldering operations. Standard configurations are available from 2-10 positions with a 0.005" coplanarity rating. 
 
Mill-Max Mfg. Corp., www.mill-max.com

The Aerial flying probe is based on Viva Integrated Platform core hardware and software. Is said to be for testing prototypes, samples and small-to-medium production runs. Uses four independent mobile test probes, which reportedly enable simultaneous double-sided testing. One Touch Per Net technique characterizes nets and identifies faults on subsequent boards, executing additional tests at the same time. Data collection and statistics functions come standard. Is compatible with Pilot flying probe, Strategy ICT and Valid functional testers. Firefly concentrates power and control of laser technology into automated selective soldering. Thermal control said to be guaranteed by an integrated temperature control system that provides continuous feedback during the soldering process. A CCD camera is included for optical inspection for testing component presence/absence and orientation. 
 
Seica Electronics, www.seica.com 
 

The USB-1149.1/4E is a USB 2.0-based boundary-scan test and in-system programming controller. Offers board testing and in-system programming of CPLDs, FPGAs, and flash memories at full theoretical programming speed. Delivers test vectors at a sustained test clock frequency of 100 MHz. Includes direct I2C and serial peripheral interface-based device programming capabilities. The SPI and I2C interfaces are independent of the JTAG test interface. Features automatic signal delay compensation for long cable runs to the UUT, slew rate control, adjustable input thresholds, software controllable signal pin reassignment, and eight analog channels for measuring target supply voltages or other signals up to +5VDC.
 
Corelis, http://www.corelis.com