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Samsung’s RF30 series reflow soldering systems has been added to the SP450V screen printer, SM and CP Series component placement systems, and associated board handling systems, to provide a full turnkey line.
  
Features include a Windows-based operator interface, a multifunctional heating system. Double-covered insulated heating zone construction is said to feature multi-ejection nozzles and fans circulating air in five directions. Dual-active cooling zones with variable speed fans reportedly bring the board temperature below the liquid state at a controlled rate. Available in 8, 10 and 12 heated zones, plus two cooling-zone configurations.

Dynatech Technology, www.dynatechsmt.com




PCB Raptor features a pressure-foot brush assembly for depanelizing PCBs. Mills, drills, routes and engraves at feeds up to a reported 600" per minute. Designed the rapid in-house PCB routing. The 60,000-rpm spindle is said to mill precision geometries required by high frequency and microwave applications. Can machine most electronics materials, including G10, FR-4, EMI-proof aluminum, copper, stainless steel, gold, Delrin, Torlon, Delmat, Kapton, Lexan and many other plastics and metals. The use of low-pitch precision ball screws on the EX model reportedly results in a resolution of ± 0.00008", an absolute accuracy of ± 0.0005", and a relative accuracy of ± 0.0002".
 
Datron, www.datrondynamics.com
 
 
DX dispenser includes a mobile handheld dispenser with a refill station. Reportedly dispenses two component reactive resins at 1:1, 1.5:1, 2:1, 4:1, and 10:1 ratios. Multiple handheld dispensers can be quickly refilled with one DXR refill station. The refill station uses two transfer pumps that feed from 5-gal. bulk containers, each equipped with follower plates. 
 
MIXPAC, www.mixpacequipment.com
  
 
 
I&J7900-LF, an RoHS-compliant, compact three-axis dispensing robot, has a work area of 8 x 8" and a z-axis of 2".
 
Is said to be simple to program, with step-by-step point-and-click instructions. Resolution is said to be 20 mm. Up to 100 programs can be stored in the robot’s data memory or flash card. Can apply dots, lines, circles, and ellipses in any point-to-point or continuous path configuration.
 
I&J Fisnar, www.ijfisnar.com

 
Hysol FP5110 is specially formulated for flip-chip image sensor modules and is said to provide adhesion to both 2- and 3-layer flexible printed circuits by bonding to both polyimide and epoxy adhesive material.
 
Bonds bumps to substrates by means of a Pb-free-compatible thermal compression process. Compatible with thermal compression and ultrasonic bonding processes; low temperature 10-sec. SnapCure at 180°C; storage requirement of -15°C.
 

The MX high-speed component placement system is said to be capable of placement rates up to 80,000 cph. Features cascading modularity, with 216 feeder slots per segment; full-range component capability; double placement areas in each module, and a multilevel transport system reported to eliminate “local head-downtimes.”
 
Mimot, www.mimot.com

  

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