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The SVS Ascent platform is for in-line, 3-D SMT inspection of solder paste depositions and component placement process control. Handles boards up to 20 x 24". Features an all-solid-state laser scanning platform with a reported 8 MHz data acquisition rate, all digital processing, and 8X oversampling. Analyzes data pixel by pixel, without merging or blending areas of acquired data. Said to permit panel setup from CAD data within 10 minutes and to detect flaws in volume, area, height, x/y position, coplanarity and bridging.
 
GSI Group, www.gsig.com

 
The Brave-Mission Message Broker Service reportedly provides a test environment for message service compliancy and verification that the device is sending and receiving CAMX messages of correct form and consistency. The Internet-based prototyping service is free, and for those who want to attach a machine to a live message broker before integrating in a production line, or who want to gain IPC-2501 experience. A test copy of Bomber-Mission, a CAMX Client simulation tool from its eX-Mission Solution Suite, is downloadable from www.ex-mission.com
 
Optimation Inc., www.optimation.com

The X1 automated x-ray inspection system automatically analyzes images of solder joints to detect structural defects. A typical inspection program is said to be created in fewer than 30 min. Uses a standard package library. Said to offer high defect detection, fast throughput and low false calls. Remote programming and real-time SPC software provided. 
 
YESTech, www.yestechinc.com
 
  
 
 
Board Station XE leverages customers’ existing IP, such as libraries, design data, and design capture infrastructure. This extended design flow is added to existing Board Station design environment. Said to offer the productivity design features found in AutoActive placement, routing and manufacturing environment; integrated access to the Topology Planner/Router and XtremeAR and XtremePCB applications. Said to leverage Board Architect schematic capture tool and is integrated with Library Management System (LMS), DMS (Data Management System), I/O Designer and the Constraint Editor System (CES).  Also integrated in the flow are ICX Pro, ICX, HyperLynx and Quiet Expert.
 
Mentor Graphics, www.mentor.com
 
The FS2500N flip chip packaging system is reportedly capable of aligning and bonding at 1.7 sec. per chip at 2 micron accuracy. Underfilling chip with gaps of 14 microns has reportedly been demonstrated in production volume with zero voids. Said to be capable of bonding via thermocompression by pulse heating head, thermosonic by 50 KHz ultrasonic system, Au/Au, Au/Sn and solder. Reported chip sizes of up to 20 x 20 mm with more than 800 bumps and pitches of less than 40 microns.
 
Toray Engineering Co., Ltd., www.toray.com
 
 
CadStar Express includes all the latest features of CadStar 9.0, with a limit of 300 pins and 50 components. A back annotation function is said to smooth file transfer from PCBs into schematics, assisting in ECO management -- particularly those associated with high-speed designs. A Do-It-Yourself booklet was created to guide the user step-by-step through the solution using design examples. The free tool can be downloaded at www.cadstarworld.com/express.
 
Zuken, www.zuken.com 
 
 

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