Hysol FP5110 is specially formulated for flip-chip image sensor modules and is said to provide adhesion to both 2- and 3-layer flexible printed circuits by bonding to both polyimide and epoxy adhesive material.
Bonds bumps to substrates by means of a Pb-free-compatible thermal compression process. Compatible with thermal compression and ultrasonic bonding processes; low temperature 10-sec. SnapCure at 180°C; storage requirement of -15°C.
The MX high-speed component placement system is said to be capable of placement rates up to 80,000 cph. Features cascading modularity, with 216 feeder slots per segment; full-range component capability; double placement areas in each module, and a multilevel transport system reported to eliminate “local head-downtimes.”
The AST-700 bottom-side, screw-fastening work cell is designed to offer the ability to selectively fasten components using screws from the bottom side after odd-form placement. Uses a bowl-style system with blow feeder to automatically present and drive screws into the desired locations. Said to offer fully programmable x, y and z motion with in-line conveyor, positive PCB stop location/clamping, and programmable fastening locations. Includes a second chance feature with screw detection and purge function to prevent false error.
IS415, a 200°C Tg product, is Pb-free compatible and offers improved signal integrity performance. Now has electrical loss in the 0.009 range using the split post resonant cavity method, and around 0.0135 using the Bereskin Stripline test method at 10 GHz. Currently available in North America, with manufacturing in Asia to begin in 2007. Is RoHS compliant and a UL94V-0-rated substrate.
The AOM-700 pick-and-place work cell is said to be capable of picking odd-form components, connectors or a variety of other parts from a tube- or bowl-style feeder. Places each component onto a PCB, offers fully programmable x, y and z motion with inline conveyor, positive PCB location/clamping, and programmable picking head selection. Rotating head permits selection of the gripper position to be used for assembly.
PRO 6 series robotic soldering system reportedly provides multiple technologies built into a single work cell. The PRO 6Td is a dual-head soldering robot that may be configured with both iron tip and diode laser soldering heads. May be independently controlled for progressive assembly or used in sequence for high output.
The soldering head and automatic solder feeder are said to be dynamically independent and adjustable from one another. May be programmed to look for known fiducial points, analyze them and automatically center for a reported 100% pinpoint accuracy.