Flotherm Version 7 electronics thermal analysis software features a response surface optimization capability. Fits a 3D surface to the entire design space. Automatically creates and runs the required number of simulations to explore the entire design space. Generates a "response surface" showing the value of the design goals for all the combinations of variables run. Said to have better design insight and intuition; rapid determination of which design parameters are crucial, and instant assessment of the effects of manufacturing variations. Applications include heat sink design; PCB component placement; fan/blower selection and the location of vents. Has the ability to embed arbitrary conductive thermal resistor networks within the overall fluid dynamics simulation. Includes a SmartPart that models heat pipes accurately and the ability to import 2D DXF files and extrude them directly into 3D shapes.