Circuits Assembly Online Magazine - Features

Uni-form epoxy preforms are available in M5-82, a linear epoxy system that remains flexible under temperature changes. Post-cure flexibility said to improve adhesion to component materials with dissimilar coefficients of thermal expansion. Developed for under-the-hood automotive applications and other environments that require seal integrity under adverse temperature conditions. Are one-part epoxy resins solid at room temperature. Melt and cure when heated, forming a seal that protects components from dust, moisture, oil, flux, solvents, conformal coatings, and other contaminants. Close tolerances on preform dimensions; consistent pre-mixed ratios of resin to catalyst; and consistent viscosity from beginning to end of batch ensure uniform. Available with outside diameters from 0.035" to 0.720". Can be dispensed as rapidly as 200 to 600 parts per minute. Said to eliminate pot-life concerns and cleanup procedures.

Multi-Seals, www.multi-seals.com

Medalist i1000 offers the VTEP v2.0 vectorless test suite, which comprises iVTEP and network parameter measurement technology. Reportedly offers unparalleled coverage of micro ball grid arrays and flip chips, as well as power and ground pins for connectors found in digital consumer products and desktop PCs. Is compatible with most MDA fixtures. An AutoDebug feature slashes debugging time to a few hours. Comes with an automatic node-guarding feature that is said to eliminate the need for manual checks of schematics for guard points. Offers two fixture options. Provides fast fixture-swapping time while maintaining high signal integrity. Available in June.

Agilent Technologies, Inc., www.agilent.com/see/i1000.

Offset Placement After Solder Screen (OPASS) printing addresses solder paste alignment errors. With the technology, the placement machine reportedly can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of prior process errors. Addresses placing small components centered on the paste and not the pad, which reduces defect rate. Said to eliminate the need for other equipment such as AOI machines.

Juki Corporation, www.jas-smt.com

The Opal FP-XII is a turnkey system for standalone and line-balancing applications. Places 01005, fine-pitch and odd-form components with a reported accuracy as good as 30 microns. Has placement rates up to 6,800 components per hour. Incorporates two independent super-fine servo-controlled heads with high-resolution encoders. Takes odd-form components up to 45 x 100 mm (up to 20 mm high). Is supplied with operator monitor, board clamping system with automatic width adjustment, nozzle exchange system and feeder lock verification. Places up to 11,600 cph with four heads or optionally 17,700 cph with eight heads.

Assembléon, www.assembleon.com

The Medalist x6000 AXI reportedly reduces manufacturing conversion costs without compromising defect-detection capability. Is said to more than double the throughput of market-leading 3D solutions. Reportedly the only one to deliver high-throughput 3D coverage that can be used to inspect the entire board. Said to reduce implementation barriers caused by high employee turnover in outsourced regions by providing a new development environment that incorporates several automatic test development features that help new users to develop high-quality programs in half the time previously required. Ready to ship in May 2007.

Agilent Technologies, www.agilent.com

NSpec Linea DL20 is for post-print, -placement or -reflow inspection. Is reportedly quick to program and debug, and a comprehensive stamp library shortens inspection time. Features full-color inspection and a low false call rate. For post reflow inspection, comes with multiple illumination techniques, including a diffuse on-axis light module.

Marantz Electronics/Christopher Associates, www.christopherweb.com