MicroPILR platform has low-profile, pin-shaped contacts that replace solder balls on semiconductor packages and plated vias in package substrates and PCBs. Benefits reportedly include reduced profile, fine pitch, improved electrical and thermal performance, and enhanced reliability. Pins can be used as internal or external interconnections in a variety of applications, including the interconnection between semiconductor die and package substrates, semiconductor packages and PCBs, the layers within package substrates, and PCBs to PCBs. Can be formed directly onto substrates and are typically nickel/gold plated copper. Range from 25 to 175 microns in height and 40 to 200 microns in pin tip diameter. Is capable of enabling contact pitches to 100 microns in a die-to-package substrate; in package-to-PCB applications, pitches to 0.3 mm or lower; and within package substrates, pitches of 150 microns or lower. Specific device applications include high-density stacked flash, DRAM and SRAM; logic plus memory packaging; and stacked and mobile memory packaging. 
 

The PMT400 rework system is designed for rework of microBGA, BGA, CSP, SMT, MCM and PTH assemblies. Proprietary Windows-based X-PC Advanced Process software provides GUI, featuring intuitive programming and Teach Mode profiling. Is Pb-free capable. Features precision gantry motion and a standard two-zone IR bottom heater. Provides performance in a small 28" sq. footprint. Includes a six-nozzle starter, network data management (XP Pro), real-time thermal control (external TC), automatic retract optics and an automated component pickup nest. Can handle 0.010" minimum component size, and offers a 2" sq. field of view, as well as 2" top- and bottom-side clearance. Provides 1 kW focused convection top heater and 14 x 20" maximum board size with 1.5 kW IR bottom heater.
 
VJ Electronix, www.vjelectronix.com
 

For low-profile IO applications, this surface mount SIP socket strip is assembled parallel to its board surface. Ideal for placement near the board edge for easy access test connections and creating pluggable adapter modules, which can sit perpendicular to the motherboard. The brass alloy receptacle press-fit accepts mated pin diameters between 0.025-0.037" and 0.025" square posts. This socket is rated at 4.5A per pin position. Suitable for reflow soldering operations. Standard configurations are available from 2-10 positions with a 0.005" coplanarity rating. 
 
Mill-Max Mfg. Corp., www.mill-max.com

The Aerial flying probe is based on Viva Integrated Platform core hardware and software. Is said to be for testing prototypes, samples and small-to-medium production runs. Uses four independent mobile test probes, which reportedly enable simultaneous double-sided testing. One Touch Per Net technique characterizes nets and identifies faults on subsequent boards, executing additional tests at the same time. Data collection and statistics functions come standard. Is compatible with Pilot flying probe, Strategy ICT and Valid functional testers. Firefly concentrates power and control of laser technology into automated selective soldering. Thermal control said to be guaranteed by an integrated temperature control system that provides continuous feedback during the soldering process. A CCD camera is included for optical inspection for testing component presence/absence and orientation. 
 
Seica Electronics, www.seica.com