Meister D+ True3D inspection system is for chiplets and system-in-package devices, including die and surface mount components.
Includes enhanced support for flex/rigid-flex and embedded component visualization in 2-D and 3-D environments.
Alpha WS-826 water-soluble solder paste is designed to provide excellent environmental stability in extreme operating conditions.
JM-50 SMT placement machine uses Takumi placement head, which automatically adjusts its height to provide optimal speed and component handling simultaneously.
iFlex placement machine includes new XT placement head with side-view camera system for vision on the fly and component heights of 21 to 21mm;
Smart Storage Rack stores electronic components and can be integrated with component counter and IMS systems or desktop reel scanner.
Press Releases
- Naprotek Appoints James Eisenhaure as Chief Financial Officer
- Naprotek Appoints James Eisenhaure as Chief Financial Officer
- ViTrox Announces Strategic Partnership with Maxim SMT to Strengthen Presence in India
- Incap UK achieves JOSCAR Zero accreditation – Strengthens its position in the defence and aerospace sector