9771 conformal coating is for use on printed circuit boards in missiles, satellites, and spacecraft. Is dual-cure and reworkable, and cures with light and moisture to ensure material that flows underneath components on PCBs fully cures.

3Di-LS2-CASE 3-D AOI has unique, highly rigid gantry structure and AI-based inspection automation functionality reduce false calls for solder defects (non-wetting) and improves speed and accuracy of solder defect detection.

SLX is a zero-setup profiling system for reflow and wave solder applications.

Solderstar VP Nano captures thermal profiles of electronics assemblies that use numerous components or require higher mass PCB substrates.