Vivid Cure LCD edge bonding adhesives are for high-speed LCD display assembly and are compatible with HumiSeal face bonding products.
Intelli-Pro AI smart factory automation software and algorithm package is designed for improving performance of AOI machines.
Etimol SW 25/FD RAN cleaning agent is drying-optimized and has been developed for SMT stencil washing systems that have no or insufficient heating or drying.
EP5G-80 is a one-component, NASA low outgassing rated epoxy with temp. cure requirement of 80°C for 4 hr.
i-Cube10 (YRH10) hybrid placer has surface mounter functions for electronic components and a die bonder for wafer components.
Double-sided, molded ball grid array is for 5G RF module design, characterization and packaging technology.
Press Releases
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S