VT-S10 series 3D AOI uses multi-direction, multi-color imaging, MPS 3D hardware and AI to reduce false calls, improve first-pass yields and optimize defect detection.
Meister D+ True3D inspection system is for chiplets and system-in-package devices, including die and surface mount components.
Includes enhanced support for flex/rigid-flex and embedded component visualization in 2-D and 3-D environments.
Alpha WS-826 water-soluble solder paste is designed to provide excellent environmental stability in extreme operating conditions.
JM-50 SMT placement machine uses Takumi placement head, which automatically adjusts its height to provide optimal speed and component handling simultaneously.
iFlex placement machine includes new XT placement head with side-view camera system for vision on the fly and component heights of 21 to 21mm;
Press Releases
- Johan Stormlund Joins Inspectis AB as Marketing and Sales Manager, Industrial Applications
- Altus Brings Heller’s Revolutionary Short-Cycle Vacuum Reflow Oven to the UK and Ireland
- High Density Packaging User Group Announces European Space Agency Membership
- High-Density Packaging User Group Announces ASKPCB Membership