HiTech CU21-3240 and CU31-2030 are one-component capillary underfills designed to protect assembled chip packages on printed circuit boards.
High-precision TR77000QM SII 3-D AOI has 5.5µm high-res 12mp imaging technology for semiconductor and packaging industry and other industries.
RMCP thick-film chip resistor with high power capability now comes in resistance values up to 10mΩ.
OM-372 Pb-free, no-clean solder paste is designed to provide ultra-high electrochemical reliability on fine-pitched, low-standoff components.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association