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APT-1400F-SL-A flying probe test system for assembled PCBAs delivers larger testing area (635 x 610mm) to accommodate 5G communications and battery management system applications.

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Loctite Ablestik ABP 8068TD high thermal die attach paste is for use in applications where no die back-side metallization is required.

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PF918-P250 SnAgBi3 alloy offers high thermal impact reliability.

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ProMetrics monitors thermal profiles during soldering. For single- and dual-lane systems and suitable for vacuums.

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GT90 and GT120 Soldering Systems now have software updates allowing users to set temperature profiles for various components or solder joints.

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TR7007 SII Ultra 3-D high-speed solder paste inspection performs at speed up to 180 cm2/sec.

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