WS-829 for printing and pin transfer applications, including LED die-attach, can be used for ball-attach on substrate in a standard BGA process, especially for sphere applications <0.25mm, as well as wafer-/panel-level packaging.
PCB antennas are for Wi-Fi, GSM, CDMA, 3G, 4G, LTE, GPS, Bluetooth, ZigBee, ISM and NB-IoT applications.
SR100E replenishment rack is designed for operation on the production line next to pick-and-place machines to facilitate efficient feeder replenishment.
F98-AJ6 series capacitors are available in 0603 and 0805 chip sizes with max. heights of 1mm and 0.8±0.1mm and feature facedown under-tab terminations designed to achieve high capacitance, high volumetric efficiency, and high PCB assembly densities.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association