Delolux 504 LED lamp is for curing UV adhesives. Features UV LEDs that reportedly achieve 3x the intensity of previous model.
ER6006 and ER7006 Bio epoxy resins provide good flow characteristics to allow potting of difficult and complex geometries. ER6006 is two-part high thermally conductive epoxy encapsulation resin primarily developed for encapsulation of LED driver units.
Siplace SX pick-and-place machine has new placement head versions, a more powerful vision system, open interfaces for special feeders and new software functions.
Viscom X7056-II BO inspects bond wires optically and radiographically in an inline system that reportedly ensures inspection of power semiconductors and encapsulated sensor elements.
With Microfactory, manufacturers can now deploy and operate automated assembly lines with fewer people.
Master Bond MasterSil 151S is a two-part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association