CX90MW waterproof USB 3.2 Gen 1 Type-C connector is for applications that require miniaturization with resistance to liquid, vibration and/or shock.
MRSI-705 high-volume configuration 5μm die bonder offers horizontal turret feature to increase speed and throughput without sacrificing flexibility, accuracy, or reliability.
DryBox cabinet is designed to store and protect 3-D printing filaments in a humidity-controlled environment.
ICCON Block and ICCON Insert connectors address high current rating demands from high-speed board-to-board and board-to-busbar data communication applications.
Palomar 8100 automated, thermosonic high-speed ball-and-stitch wire bonder performs ball bumping and customized looping profiles.
VEMD4010X01 and VEMD4110X01 surface-mount automotive-grade silicon PIN photodiodes come in 0805 case size with 0.7mm profile.
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association