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If each component can be verified, then the finished product falls into place.

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Area arrays face higher thermal stress, leading to topside ball delamination. A review of the literature, and a novel solution.

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This study established the ideal sensitivity setting for catching BGA voids.

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This technique permits reuse of test data and cuts costs by eliminating ICT and functional test.

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Regardless of flux, silver-containing alloys can achieve acceptable wetting at high temperatures.

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Most machines pass the test, but some key changes are ahead.

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