Norcross, GA, March 23 -- The Electronics Assembly Systems Division of Siemens Logistics and Assembly Systems Inc. is providing SMT Process training on April 18-22, in partnership with the Center for Electronics Manufacturing & Assembly (CEMA) at Rochester Institute of Technology, (RIT).  
 
The training will take place at RIT's CEMA facility in New York. It features a fully equipped SMT Laboratory, which includes screen printing, dispensing, pick-and-place, reflow, rework stations, optoelectronics workstations, wire bonding, test and inspection equipment.
 
The hands-on course provides participants with a thorough understanding of SMT and advanced packaging principles needed for supporting and troubleshooting the SMT process. It will offer discussions on process parameters and process characteristics, paste qualification including lead-free solder compounds, as well as identifying and correcting defects.

The course is offered as a result of the Siemens Electronics Consortium for the Advancement of Electronics Manufacturing Education (CAEME).  
 

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