North Reading, MA, March 23 - Teradyne Inc. has announced a new 3-D x-ray imaging technology for detecting PCB solder and production defects. 
 
Using a patented off-center tomosynthesis imaging technique, ClearVue is suited for densely packed single- or double-sided boards that use BGA-style components, or when loss of electrical or optical access is problematic.
 
Compared to laminography and other 3-D x-ray  techniques, the technology reportedly provides superior image clarity, diagnostic capabilities and full board coverage to expose solder (including lead-free) flaws that are otherwise overlooked. 
 
Operates using a stationary x-ray source and detector and, unlike conventional systems, does not require complex or rotating mechanical parts. Said to result in lower false call rates (promising up to 40 times improvement over existing solutions), improved reliability, better repeatability and improved cycle times.   
 

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