National Physical Laboratory has developed a new instrument for measuring solder properties. The advent of lead-free alloys makes it imperative to obtain accurate material properties on volumes of materials under 1mm^3. Instruments must be able to measure and displace small distances, typically a few micrometers to a precision of 0.1µm, and to measure low forces.

NPL has developed a machine that achieves this capability. Measurements are now possible at typical stresses and strains found in solder joints, resulting in realistic fatigue and creep rates. These values are essential for accurate, statistically based life-time predictions of lead-free reliability.

For further information contact:

Dr.Chris Hunt: chris.hunt@npl.co.uk  

milos.dusek@npl.co.uk

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