Adhesives Research Debuts Bonding for CMP Polishing Pads & Wafer Dicing
At SEMICON West booth # 9209, Adhesives Research will feature its ARclad custom PSA tape technology for the semiconductor industry, which includes several tape products for chemical mechanical polishing, as well as a heat-releasable wafer dicing tape for high-risk dies.
PSA tape technologies cover three applications within CMP, including the fabrication of stacked CMP pads, bonding CMP pads to polishing machine platens and bonding CMP textiles to stainless steel polishing heads.
ARclad 90450 is a double-faced bonding tape using one permanent adhesive chemistry for bonding to the top pad and another permanent adhesive chemistry specific to bonding to the foam sub pad.
ARclad 8904 and ARclad90334 were designed for bonding stacked pads to the platen.
Both are double-faced tapes with a permanent adhesive for bonding to the sub pad and a removable adhesive for bonding to the platen. Designed for adhesion to low surface-energy polishing tables. Contain a blue polyethylene release liner. Prevents tearing during application and improve die cutting, while promoting an easy, smooth release. 8904 employs a permanent rubber-based pressure-sensitive adhesive for bonding to the sub pad, while 90334 uses an acrylic permanent pressure-sensitive adhesive.
ARclad 90452 is a permanent/removable double-faced tape with the permanent adhesive designed to bond the polishing pad, without a sub pad, directly to the platen. The removable adhesive allows for easy, clean pad removal when polishing is completed.
ARclad 8917,a permanent/removable CMP/carrier bonding tape, provides good solvent resistance, operability in a broad functional pH range, offers a smooth adhesive surface to improve CMP yields, creates a stronger bond to CMP textiles and ensures clean removability from machine surfaces. Comes with two clear polyester liners for visual inspection of the bonding surface prior to application, has good coat weight (9.0 mils) and total thickness variation control.
Heat-releasable, pressure-sensitive adhesive tapes with a stretchable backing film and a polyester film release liner allow needle-less removal of fragile die, while reducing mechanical damage. With the application of heat, the tapes release cleanly, leaving no adhesive residue. The stretchable backing allows for easier mounting, dicing and die-removal, while enhancing visual system capabilities.
Adhesives Research Inc., www.adhesivesresearch.com
