AlSiC (Aluminum Silicon Carbide) is a metal matrix composite suited for optoelectronic housings and lids.

Enables a tailored coefficient of thermal expansion, for compatibility with various electronic devices and assemblies. Unlike traditional housing materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. CTE matching capabilities ensure alignment and precision.

Exhibits a high thermal conductivity that results in efficient thermal dissipation and prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional housing materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.

Near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and rapid prototyping. The un-restricted geometry enables inclusion of design features such as septums, walls and radial features. The casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.

CPS Corp., www.alsic.com

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