According to Christopher Associates, OEM requirements for improved manufacturing yields have led to strong demand for the Koh Young 3 dimensional solder paste inspection systems.

The KY 3030VAXL (24 x 27” panel size) high-speed 3-D solder paste inspection system was developed to inspect very high density, high technology telecommunications substrates for 100% volumetric and shape defects. Designed, manufactured and delivered within 10 weeks of receipt of order to a large EMS manufacturer.

Additional installations include a number of the KY 3030VAL (18 x 20” substrate) systems installed at a major EMS manufacturer; a major automotive electronics manufacturer has also ordered multiple systems. Among the advantages cited after extensive evaluations by each customer were ease of use, accuracy and speed.  

Christopher Associates Inc., christopherweb.com

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