Finetech has developed a Mobile Device Rework (MDR) System for the Fineplacer Pico for the demands of reworking mobile phones, PDAs, gaming handhelds, multimedia portables, Bluetooth and WLAN equipment, memory cards, notebooks and portable medical equipment such as pacemakers. The new system will be on display in booth 5002 at ATExpo in Rosemont, IL
 
Equipped with a new motorized placement module, the system achieves a degree of reproducibility unrivalled in manual rework and minimizes operator influence.  WinCOMISS software controls bond force during placement and soldering, resulting in a production-compatible reflow process.
 
The lead-free capable system provides the capability to perform the entire rework process for the smallest of devices up to RF shield cans, and for extremely high-density packages.  A fully automated version is also available to process pallets of system boards through the entire rework cycle: shield can and device removal, residual solder paste removal, printing, and device and shield replacement.
 
Also available, but not on display, is an optional integrated solder paste dispenser module that can dispense solder paste dots small enough for 01005 rework.  It can also be configured to dispense epoxy and underfill.  
 

Finetech Inc., finetechusa.com

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