Electrolock Debuts RoHS Solder Pallet Material
Published: 12 December 2005
by Staff
Electrolock-ESD material is RoHS-compliant to meet regulatory demands for lead-free manufacturing.
Rich Reed, business unit manager, said: "When the 2006 lead-free requirements go into effect, high-temperature performance will become a more critical issue for electronic contract manufacturers. Our Electrolock-ESD material was designed to deliver consistent performance at temperatures in excess of 550°F, without deflection, which ensures a rigid, even surface and optimum machinability."
Rich Reed, business unit manager, said: "When the 2006 lead-free requirements go into effect, high-temperature performance will become a more critical issue for electronic contract manufacturers. Our Electrolock-ESD material was designed to deliver consistent performance at temperatures in excess of 550°F, without deflection, which ensures a rigid, even surface and optimum machinability."
Unlike conventional material solutions, the compound reportedly yields a smooth surface without the need for sanding. Durable surface is impervious to chemical reactions and eliminates glass blooming associated with traditional solder pallet materials.
Comes in a variety of sizes to accommodate a range of applications.
Electolock Inc., electrolock.com
