Micro HVR addresses the high-volume rework market  where hundreds of boards must be repaired due either to high value, component scarcity or where manual rework is illogical. For repair challenges arising from component failure, assembly error, device revision and firmware updates, the system automatically sequences the repair steps: component de-solder and discard, residual solder removal, flux dispense (where necessary) and component re-solder.  All steps are automated. 
 
The pivot arm, with component rotation capability, is automated for hands-free placement. Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate. Uses ”single-sweep“ residual solder removal technique. Has placement accuracy better than 10 µm, is suitable for large BGAs to fine-pitch CSPs and flip chips. 

A ”friction-free“ positioning table with x,y planar motor and high-resolution z-axis control is integrated.  An additional fast linear axis accomodates large substrates. 
Features an open data interface structure to the assembly line, and a modular design that is adaptable for different applications.
 
Can be configured with solder paste dispense for 0201 devices.  Can perform for extended periods of time at elevated temperatures.
 
Finetech, finetechusa.com
Booth 1481

• Prev
• Next