Non-Silicone Heat Transfer Compound (HTC) provides efficient thermal coupling of electrical and electronic components. Provides non-creep characteristics and thermal conductivity even at high temperatures: 0.9 W/m.K. Has a broad operating temperature range (-50º to +130º) and offers low toxicity.  HTC Plus (HTCP) provides even higher thermal conductivity at 2.8 W/m.K with superior heat transfer characteristics.
 
Silicone Heat Transfer Compound (HTSP) is a thermally conductive paste for special applications where thermal management is critical. Operates from -50º to +200º, is a metal oxide filled silicone oil providing thermal conductivity at 3.0W/m.K.
 
The flame retardant ER 2074 epoxy resin exhibits thermal conductivity and is free of abrasive fillers such as alumina. Ensures less wear on mix and dispense and other processing equipment. Shows low viscosity when mixed and the exotherm temperature rise on curing is low.
 
Aquacoat Plus eliminates the need for extraction and other precautions normally required for the application of conventional solvent-based conformal coatings. The aqueous conformal coating is non-flammable, contains low levels of VOCs and no isocyan­ates, so it can be soldered through without fear of highly toxic gases being produced. Is phenol-free, so is non-corrosive to cadmium and zinc plate. Based on polymeric materials, offers adhesion on a variety of substrates and a wide operating temperature range. Available in two formulations: WBP is the standard product and WBPS (Sprayable) is for use in selective film coating equipment. Is DEF-STAN, MIL and IPC-CC-830 and RoHS compliant.
 
Flexible Lead-Free Conformal Coating (LFCC) is transparent and fast drying. Designed to protect electronic circuitry processed with lead-free soldering products, it provides adhesion to lead-free flux and fluoresces under UV light for ease of inspection. Can be soldered through without highly toxic gases being produced and is non-corrosive to cadmium and zinc plate.
 
Electrolube, electrolube.com

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