Practical Components Inc., a distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, has added Thin Array Plastic Package (TAPP) to its selection. 
 
Packaging companies Amkor Technology and ASAT Holdings entered into a multi-year cross-licensing agreement to provide Amkor with a license for its TAPP semiconductor package technology.
 
“Over the past few years, the semiconductor industry has seen an extensive adoption of QFN packages, fueled in part by the success of Amkor’s proprietary MicroLeadFrame package technology and ASAT’s Leadless Plastic Chip Carrier package. We look forward to integrating ASAT’s TAPP with our MicroLeadFrame family of packages to support our growing base of customers requiring innovative QFN package solutions,” said Jim Fusaro, Amkor’s corporate VP for product management, in a statement.
 
Available TAPP solder finishes are eutectic Sn/Pb and Pb-free with lead counts from 28 to 208.  The very thin, fine-pitch package with an exposed die attach pad allows for improved thermal performance and a power/ground ring option for enhanced electrical characteristics.  
 
Practical Components is the exclusive distributor of mechanical samples for Amkor Technology as well as distributing components from most other manufacturers. 
 
Practical Components Inc., practicalcomponents.com

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