Munich – SUSS MicroTec successfully completed initial reliability testing with IBM for 300 mm Pb-free C4NP solder bumped wafers. SUSS is currently building a high-volume manufacturing C4NP tool set for IBM in preparation for production use.
 
C4NP, a wafer-bumping technology developed by IBM, stands for Controlled Collapse Chip Connection - New Process. It is an alternative to the electroplating process. Bulk solder is injection-molded into glass molds and subsequently transferred from mold to wafer in a single step.
 
In the reliability testing, 300 mm wafers were bumped with SnCu and SnAg solders using a 200 micron pitch with 1.3 million bumps per wafer test vehicle. Chips measuring 14.7 mm² were joined to organic buildup chip carriers and subjected to the following tests:
 
JEDEC moisture level 3 preconditioning
Shock and vibration
Deep thermal cycling (-55 to + 125°C)
HAST and THB moisture stressing                                                                                                          
High temperature storage
Electromigration
Wettability
Construction analysis
Alpha emissions
 

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