Flopack V6.2 Web-based SmartPart library reportedly generates fast, accurate thermal models for IC packages and associated parts. Thermal models can be instantly imported into novel software to analyze component, board and system cooling requirements. Features a major expansion of the power/discrete semiconductor package library; a new parametric rules engine that checks for errors in design data inputs; and enhanced, more accurate bond wire model. 

Flomerics, www.flopack.com