The Dow Corning DA-6534 high-performance thermal adhesive addresses the issue of overheating in advanced flip-chip BGA devices. Combines silicone-based chemistries with a silver filler to achieve high thermal conductivity and elasticity at high and low temperatures. Achieves thermal resistance of 0.09 cm² C/W at 24µ. Said to offer good dispensability. Bondline thickness can be controlled through pressure and time.

Dow Corning Corporation, www.dowcorning.com